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1. (WO2017150222) SHAPE MEASURING DEVICE
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Pub. No.: WO/2017/150222 International Application No.: PCT/JP2017/005963
Publication Date: 08.09.2017 International Filing Date: 17.02.2017
IPC:
G01B 21/00 (2006.01) ,G01B 5/00 (2006.01) ,G01B 5/20 (2006.01) ,G01B 5/213 (2006.01) ,G01B 11/24 (2006.01) ,G01B 21/20 (2006.01)
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
21
Measuring arrangements or details thereof in so far as they are not adapted to particular types of measuring means of the other groups of this subclass
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
5
Measuring arrangements characterised by the use of mechanical means
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
5
Measuring arrangements characterised by the use of mechanical means
20
for measuring contours or curvatures
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
5
Measuring arrangements characterised by the use of mechanical means
20
for measuring contours or curvatures
213
for measuring radius of curvature
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11
Measuring arrangements characterised by the use of optical means
24
for measuring contours or curvatures
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
21
Measuring arrangements or details thereof in so far as they are not adapted to particular types of measuring means of the other groups of this subclass
20
for measuring contours or curvatures, e.g. determining profile
Applicants:
AGC株式会社 AGC INC. [JP/JP]; 東京都千代田区丸の内一丁目5番1号 5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1008405, JP
Inventors:
森谷 幸紀 MORIYA Koki; JP
藤井 誠 FUJII Makoto; JP
黒石 博信 KUROISHI Hironobu; JP
小野 丈彰 ONO Takeaki; JP
中村 謙太 NAKAMURA Kenta; JP
Agent:
特許業務法人栄光特許事務所 EIKOH PATENT FIRM, P.C.; 東京都港区西新橋一丁目7番13号 虎ノ門イーストビルディング10階 Toranomon East Bldg. 10F, 7-13, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 1050003, JP
Priority Data:
2016-03802429.02.2016JP
Title (EN) SHAPE MEASURING DEVICE
(FR) DISPOSITIF DE MESURE DE FORME
(JA) 形状測定装置
Abstract:
(EN) This shape measuring device measures the shape of a curved substrate having a first surface and a second surface. The shape measuring device is provided with: a substrate support unit for supporting the second surface of the curved substrate, the substrate support unit being parallel to the second surface; and a shape measurement unit for measuring the shape of the curved substrate. This makes it possible to accurately measure the curvature of a curved substrate or a deviation relative to a normal from a design.
(FR) La présente invention concerne un dispositif de mesure de forme permettant de mesurer la forme d'un substrat incurvé présentant une première surface et une seconde surface. Le dispositif de mesure de forme comprend: une unité de support de substrat servant à supporter la seconde surface du substrat incurvé, l'unité de support de substrat étant parallèle à la seconde surface; et une unité de mesure de forme servant à mesurer la forme du substrat incurvé. Ceci permet de mesurer avec précision la courbure d'un substrat incurvé ou une déviation par rapport à un conception normale.
(JA) 形状測定装置は、第1面と第2面とを有する屈曲基材の形状を測定する形状測定装置である。形状測定装置は、屈曲基材の第2面を支持し、第2面と平行な基材支持部と、屈曲基材の形状を測定する形状測定部と、を備える。これにより、屈曲基材の曲率やデザインからの法線偏差を正確に測定可能となる。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)