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1. (WO2017150114) POLISHING COMPOSITION

Pub. No.:    WO/2017/150114    International Application No.:    PCT/JP2017/004582
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Thu Feb 09 00:59:59 CET 2017
IPC: C09K 3/14
B24B 37/00
C09G 1/02
H01L 21/304
Applicants: AT SILICA INC.
ATシリカ株式会社
SHIN-ETSU HANDOTAI CO., LTD.
信越半導体株式会社
Inventors: FUKUI, Koichi
福井 孝一
YUASA, Takehiro
湯浅 雄大
KAWAURA, Yuji
川浦 優二
Title: POLISHING COMPOSITION
Abstract:
The present invention proposes a polishing composition which has excellent wafer-protecting ability (resistance to alkali etching) and which can be expected to attain a reduction in haze while maintaining a low particle level. The present invention provides: a polishing composition which comprises (A) abrasive grains, (B) a water-soluble alkali compound, (C) hydroxyethyl cellulose having a weight-average molecular weight of 500,000 or lower, (D) at least one organic compound selected from among alkyl glucosides and alkanolamides, and (E) water; and a method for polishing a silicon wafer using the polishing composition.