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|1. (WO2017150114) POLISHING COMPOSITION|
|Applicants:||AT SILICA INC.
SHIN-ETSU HANDOTAI CO., LTD.
The present invention proposes a polishing composition which has excellent wafer-protecting ability (resistance to alkali etching) and which can be expected to attain a reduction in haze while maintaining a low particle level. The present invention provides: a polishing composition which comprises (A) abrasive grains, (B) a water-soluble alkali compound, (C) hydroxyethyl cellulose having a weight-average molecular weight of 500,000 or lower, (D) at least one organic compound selected from among alkyl glucosides and alkanolamides, and (E) water; and a method for polishing a silicon wafer using the polishing composition.