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1. (WO2017150111) GLASS SUBSTRATE HEAT-PROCESSING METHOD

Pub. No.:    WO/2017/150111    International Application No.:    PCT/JP2017/004556
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Thu Feb 09 00:59:59 CET 2017
IPC: C03B 25/02
B28D 5/00
C03B 33/033
C03B 33/08
B23K 26/38
Applicants: NIPPON ELECTRIC GLASS CO., LTD.
日本電気硝子株式会社
NIPPON ELECTRIC GLASS TAIWAN CO., LTD.
台湾電気硝子股▲ふん▼有限公司
Inventors: INAYAMA Naotoshi
稲山 尚利
KAWAGUCHI Takahiro
川口 貴弘
MINARI Taiki
三成 泰紀
WU Chao-Lin
呉 昭霖
CHENG Chih-Wei
程 致維
LU Fang-Yen
呂 芳延
Title: GLASS SUBSTRATE HEAT-PROCESSING METHOD
Abstract:
In this invention, the entirety of a glass substrate 2 having a thickness of 500 μm or less is stacked onto a setter 1, and the glass substrate 2 is heat-processed in this state for the purpose of decreasing the heat-shrinking rate thereof. In this process, for the glass substrate 2, a substrate is used in which the edge portion strength when curved in such a manner that the front surface 2a side is convex and the edge portion strength when curved in such a manner that the back surface 2b side is convex are both 200 MPa or greater.