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|1. (WO2017150111) GLASS SUBSTRATE HEAT-PROCESSING METHOD|
|Applicants:||NIPPON ELECTRIC GLASS CO., LTD.
NIPPON ELECTRIC GLASS TAIWAN CO., LTD.
|Title:||GLASS SUBSTRATE HEAT-PROCESSING METHOD|
In this invention, the entirety of a glass substrate 2 having a thickness of 500 μm or less is stacked onto a setter 1, and the glass substrate 2 is heat-processed in this state for the purpose of decreasing the heat-shrinking rate thereof. In this process, for the glass substrate 2, a substrate is used in which the edge portion strength when curved in such a manner that the front surface 2a side is convex and the edge portion strength when curved in such a manner that the back surface 2b side is convex are both 200 MPa or greater.