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1. (WO2017150096) SEMICONDUCTOR DEVICE

Pub. No.:    WO/2017/150096    International Application No.:    PCT/JP2017/004376
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Wed Feb 08 00:59:59 CET 2017
IPC: H01L 21/52
Applicants: MITSUBISHI MATERIALS CORPORATION
三菱マテリアル株式会社
Inventors: NISHIMOTO Shuji
西元 修司
NAGATOMO Yoshiyuki
長友 義幸
Title: SEMICONDUCTOR DEVICE
Abstract:
This semiconductor device is characterized in being provided with: a circuit layer comprising an electrically conductive material; a semiconductor element mounted on one surface of the circuit layer; and a ceramic substrate positioned on the other surface of the circuit layer, an Ag ground layer having a glass layer and an Ag layer laminated on the glass layer being formed on the one surface of the circuit layer, and the Ag layer of this Ag ground layer being directly joined with the semiconductor element.