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1. (WO2017150058) ANISOTROPIC CONDUCTIVE BONDING MEMBER, SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Pub. No.:    WO/2017/150058    International Application No.:    PCT/JP2017/003589
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Thu Feb 02 00:59:59 CET 2017
IPC: H01L 21/60
H01R 11/01
Applicants: FUJIFILM CORPORATION
富士フイルム株式会社
Inventors: YAMASHITA Kosuke
山下 広祐
Title: ANISOTROPIC CONDUCTIVE BONDING MEMBER, SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Abstract:
The objective of the present invention is to provide: an anisotropic conductive bonding member which is capable of achieving excellent conduction reliability and insulation reliability; a semiconductor device which uses this anisotropic conductive bonding member; a semiconductor package; and a method for manufacturing a semiconductor device. An anisotropic conductive bonding member according to the present invention is provided with: an insulating base that is formed of an inorganic material; a plurality of conduction paths that are formed of conductive members and penetrate through the insulating base in the thickness direction, while being insulated from each other; and an adhesive layer that is provided on the surface of the insulating base. Each conduction path has a projected portion that protrudes from the surface of the insulating base; the projected portion of each conduction path is buried in the adhesive layer; and the adhesive layer contains a polymer material and an antioxidant material.