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1. (WO2017150053) RESIN-SEALED VEHICLE-MOUNTED CONTROL DEVICE
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Pub. No.: WO/2017/150053 International Application No.: PCT/JP2017/003512
Publication Date: 08.09.2017 International Filing Date: 01.02.2017
IPC:
H05K 3/28 (2006.01) ,H01L 21/56 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/18 (2006.01) ,H05K 5/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5
Casings, cabinets or drawers for electric apparatus
Applicants:
日立オートモティブシステムズ株式会社 HITACHI AUTOMOTIVE SYSTEMS, LTD. [JP/JP]; 茨城県ひたちなか市高場2520番地 2520, Takaba, Hitachinaka-shi, Ibaraki 3128503, JP
Inventors:
伊藤 真紀 ITO Maki; JP
石井 利昭 ISHII Toshiaki; JP
河合 義夫 KAWAI Yoshio; JP
露野 円丈 TSUYUNO Nobutake; JP
金子 裕二朗 KANEKO Yujiro; JP
福沢 尭之 FUKUZAWA Takayuki; JP
浅野 雅彦 ASANO Masahiko; JP
Agent:
戸田 裕二 TODA Yuji; JP
Priority Data:
2016-04170704.03.2016JP
Title (EN) RESIN-SEALED VEHICLE-MOUNTED CONTROL DEVICE
(FR) DISPOSITIF DE COMMANDE MONTÉ SUR VÉHICULE SCELLÉ PAR RÉSINE
(JA) 樹脂封止型車載制御装置
Abstract:
(EN) The purpose of the present invention is to provide an ECU structure which allows for the filling of a resin without warping an electronic substrate. A resin-sealed vehicle-mounted control device comprises a circuit substrate, a base member which houses the circuit substrate, and a resin filled between the circuit substrate and the base member, wherein the base member includes a base portion to which the circuit substrate is fixed, and a side wall opposing a lateral-face side of the circuit substrate, wherein the resin is provided at least between the circuit substrate and the base portion, and the side wall has an opening somewhere closer to the base portion side than a position opposing the lateral-face side of the electronic substrate.
(FR) L’objectif de la présente invention est de fournir une structure d’unité de commande électronique (UCE) qui permet de charger une résine sans gauchissement d’un substrat électronique. Un dispositif de commande monté sur véhicule scellé par résine comprend un substrat de circuit, un élément de base qui loge le substrat de circuit, et une résine chargée entre le substrat de circuit et l’élément de base, l’élément de base comprenant une partie de base à laquelle le substrat de circuit est fixé, et une paroi latérale opposée à un côté de face latérale du substrat de circuit, la résine étant disposée au moins entre le substrat de circuit et la partie de base, et la paroi latérale ayant une ouverture à un emplacement plus proche du côté de partie de base qu’une position opposée au côté de face latérale du substrat électronique.
(JA) 電子基板が歪むことなく樹脂を充填することができるECUの構造を提供することを目的とする。回路基板と、前記回路基板を収容するベース部材と、前記回路基板とベース部材との間に充填された樹脂を有する樹脂封止型車載制御装置において、前記ベース部材は、前記回路基板が固定された基部と、前記回路基板の側面側と対向する側壁と、を有し、前記樹脂は、少なくとも前記回路基板と前記基部との間に設けられ、前記側壁は、前記電子基板の側面側と対向する位置よりも前記基部側のいずれかに開口を有する電子制御装置。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)