Search International and National Patent Collections

1. (WO2017150038) SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT METHOD, AND STORAGE MEDIUM

Pub. No.:    WO/2017/150038    International Application No.:    PCT/JP2017/003205
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Tue Jan 31 00:59:59 CET 2017
IPC: H01L 21/304
Applicants: TOKYO ELECTRON LIMITED
東京エレクトロン株式会社
Inventors: EGASHIRA Keisuke
江頭 佳祐
OHNO Hiroki
大野 広基
Title: SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT METHOD, AND STORAGE MEDIUM
Abstract:
[Problem] To reliably prevent pattern collapse even when fluid for preventing drying and supercritical fluid are not replaced sufficiently, and to reduce the time required for replacing the fluid for preventing drying with the supercritical fluid. [Solution] A substrate treatment method provided with: a step for silylation treatment by supplying a silylation agent to the surface of a wafer W that has been washed in pre-processing; a step for IPA liquid puddling by supplying IPA to the surface of the wafer that has undergone the silylation treatment; and a step for transporting the wafer on which IPA liquid puddling has been formed into a substrate treatment vessel 31 and performing supercritical treatment.