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1. (WO2017150018) SEMICONDUCTOR PROCESSING SHEET

Pub. No.:    WO/2017/150018    International Application No.:    PCT/JP2017/002514
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Thu Jan 26 00:59:59 CET 2017
IPC: H01L 21/301
C09J 7/02
C09J 201/00
Applicants: LINTEC CORPORATION
リンテック株式会社
Inventors: NAKAMURA Masatomo
中村 優智
ADACHI Issei
安達 一政
Title: SEMICONDUCTOR PROCESSING SHEET
Abstract:
Provided is a semiconductor processing sheet provided with a base film and a pressure-sensitive adhesive layer laminated on at least one side of the base film, the semiconductor processing sheet being characterized in that the base film contains a vinyl chloride-based resin and an adipate ester-based plasticizer and a terephthalate ester-based plasticizer as plasticizers and the mass ratio of the content of the adipate ester-based plasticizer with reference to the total content of the adipate ester-based plasticizer and the terephthalate ester-based plasticizer in the base film is 50-80 mass%. Even while using a replacement for alkyl phthalate esters as plasticizer, this semiconductor processing sheet exhibits a satisfactory flexibility and can suppress the occurrence of residues when peeled from an adherend.