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1. (WO2017150017) SUBSTRATE FILM FOR SEMICONDUCTOR PROCESSING SHEET, AND SEMICONDUCTOR PROCESSING SHEET

Pub. No.:    WO/2017/150017    International Application No.:    PCT/JP2017/002513
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Thu Jan 26 00:59:59 CET 2017
IPC: H01L 21/301
Applicants: LINTEC CORPORATION
リンテック株式会社
Inventors: SAIKI Naoya
佐伯 尚哉
NAKAMURA Masatomo
中村 優智
YAMASHITA Shigeyuki
山下 茂之
Title: SUBSTRATE FILM FOR SEMICONDUCTOR PROCESSING SHEET, AND SEMICONDUCTOR PROCESSING SHEET
Abstract:
This semiconductor processing sheet substrate film, for use in a semiconductor processing sheet provided with a substrate film and an adhesive layer laminated on at least one side of the substrate film, is characterized by containing a vinyl chloride resin and by further containing terephthalic acid ester, adipic acid ester and barium stearate. Further, a semiconductor processing sheet provided with said substrate film is provided. By means of this semiconductor processing sheet substrate film and semiconductor processing sheet, sufficient expandability can be exhibited even while using a substitute for alkyl phthalate esters as a plasticizer, excellent pickup performance is achieved, reduction of said pickup performance over time is suppressed, and the occurrence of residues is suppressed during removal from an adherend.