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1. (WO2017149966) ELECTRONIC CIRCUIT MODULE AND METHOD FOR TESTING ELECTRONIC CIRCUIT MODULE

Pub. No.:    WO/2017/149966    International Application No.:    PCT/JP2017/001475
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Thu Jan 19 00:59:59 CET 2017
IPC: H05K 3/46
H01L 23/12
H01L 25/00
H05K 1/11
Applicants: ALPS ELECTRIC CO., LTD.
アルプス電気株式会社
Inventors: MARUYAMA, Takashi
丸山 孝司
SUDA, Shigeru
須田 茂
MIYAZAKI, Masami
宮崎 正己
INOKUCHI, Daisuke
井口 大輔
Title: ELECTRONIC CIRCUIT MODULE AND METHOD FOR TESTING ELECTRONIC CIRCUIT MODULE
Abstract:
[Problem] To provide an electronic circuit module that has test electrodes in the inner layer of a multilayer substrate and that enables a reduction in size, and a method for testing an electronic circuit module in which preliminary work for performing a failure analysis is facilitated. [Solution] An electronic circuit module 100 provided with a multilayer substrate 10 and a plurality of electronic components 31 mounted on the uppermost layer 10a of the multilayer substrate 10, wherein a plurality of land electrodes 11 necessary for normal operation are provided on the lowermost layer 10b of the multilayer substrate 10, test electrodes 13 connected to the electronic components 31 are provided in the inner layer 10c of the multilayer substrate 10, the test electrodes 13 and the land electrodes 11 are not connected, and the test electrodes 13 are provided at positions overlapping the land electrodes 11 in plan view.