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1. (WO2017149811) COPPER FOIL WITH CARRIER, PRODUCTION METHOD FOR CORELESS SUPPORT WITH WIRING LAYER, AND PRODUCTION METHOD FOR PRINTED CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/149811 International Application No.: PCT/JP2016/076047
Publication Date: 08.09.2017 International Filing Date: 05.09.2016
IPC:
C23C 14/06 (2006.01) ,B32B 7/06 (2006.01) ,B32B 15/04 (2006.01) ,C23C 14/14 (2006.01) ,C23C 28/00 (2006.01) ,H01L 23/12 (2006.01) ,H05K 1/09 (2006.01) ,H05K 3/46 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06
characterised by the coating material
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
04
characterised by the connection of layers
06
permitting easy separation
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06
characterised by the coating material
14
Metallic material, boron or silicon
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
28
Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups C23C2/-C23C26/173
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
三井金属鉱業株式会社 MITSUI MINING & SMELTING CO., LTD. [JP/JP]; 東京都品川区大崎一丁目11番1号 1-11-1 Osaki, Shinagawa-Ku, Tokyo 1418584, JP
Inventors:
松浦 宜範 MATSUURA Yoshinori; JP
Agent:
高村 雅晴 TAKAMURA Masaharu; JP
加島 広基 KASHIMA Hiromoto; JP
武石 卓 TAKEISHI Taku; JP
Priority Data:
2016-03730829.02.2016JP
Title (EN) COPPER FOIL WITH CARRIER, PRODUCTION METHOD FOR CORELESS SUPPORT WITH WIRING LAYER, AND PRODUCTION METHOD FOR PRINTED CIRCUIT BOARD
(FR) FEUILLE DE CUIVRE PRÉSENTANT UN SUPPORT, PROCÉDÉ DE PRODUCTION D'UN SUPPORT SANS NOYAU AVEC COUCHE DE CÂBLAGE ET PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ
(JA) キャリア付銅箔、並びに配線層付コアレス支持体及びプリント配線板の製造方法
Abstract:
(EN) Provided is a copper foil with a carrier. The copper foil demonstrates excellent peeling resistance with respect to a developer liquid during a photoresist development step. The copper foil can also engender excellent stability in the mechanical peeling strength of the carrier. This copper foil with a carrier comprises: a carrier; an adhesion metal layer that is provided upon the carrier and is configured from at least one type of metal selected from the group that consists of Ti, Cr, and Ni; a peeling assistance layer that is provided upon the adhesion metal layer and is configured from copper; a peeling layer that is provided upon the peeling assistance layer; and an ultrathin copper layer that is provided upon the peeling layer.
(FR) L'invention porte sur une feuille de cuivre pourvue d'un support. La feuille de cuivre présente une excellente résistance au pelage par rapport à un liquide de développement pendant une étape de développement de photorésine. La feuille de cuivre peut également donner lieu à une très bonne stabilité de la résistance au pelage mécanique du support. Cette feuille de cuivre présentant un support comprend : un support ; une couche métallique d'adhésion qui est disposée sur le support et constituée à partir d'au moins un type de métal sélectionné dans le groupe constitué de Ti, Cr, et Ni ; une couche d'aide au pelage qui est disposée sur la couche métallique d'adhésion et qui est constituée à partir de cuivre ; une couche de pelage qui est disposée sur la couche d'aide au pelage ; et une couche de cuivre ultramince qui est disposée sur la couche de pelage.
(JA) フォトレジスト現像工程において現像液に対して優れた耐剥離性を呈するとともに、キャリアの機械的剥離強度の優れた安定性をもたらすことが可能な、キャリア付銅箔が提供される。このキャリア付銅箔は、キャリアと、キャリア上に設けられ、Ti、Cr及びNiからなる群から選択される少なくとも1種の金属で構成される密着金属層と、密着金属層上に設けられ、銅で構成される剥離補助層と、剥離補助層上に設けられる剥離層と、剥離層上に設けられる極薄銅層とを備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)