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1. (WO2017149773) METAL CORE SUBSTRATE AND METHOD FOR MANUFACTURING METAL CORE SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/149773 International Application No.: PCT/JP2016/056843
Publication Date: 08.09.2017 International Filing Date: 04.03.2016
IPC:
H05K 3/46 (2006.01) ,H05K 3/34 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
Applicants:
株式会社メイコー MEIKO ELECTRONICS CO., LTD. [JP/JP]; 神奈川県綾瀬市大上5丁目14番15号 5-14-15, Ogami, Ayase-shi, Kanagawa 2521104, JP
Inventors:
戸田 光昭 TODA, Mitsuaki; JP
石田 倫一 ISHIDA, Tomokazu; JP
岩本 光生 IWAMOTO, Mitsuo; JP
Agent:
長門 侃二 NAGATO, Kanji; JP
Priority Data:
Title (EN) METAL CORE SUBSTRATE AND METHOD FOR MANUFACTURING METAL CORE SUBSTRATE
(FR) SUBSTRAT À NOYAU MÉTALLIQUE ET PROCÉDÉ DE FABRICATION DE SUBSTRAT À NOYAU MÉTALLIQUE
(JA) メタルコア基板及びメタルコア基板の製造方法
Abstract:
(EN) Disclosed is a metal core substrate having: a laminated body (7) configured from a plurality of metal plates (3, 5), and a plurality of insulating resin layers (2, 4, 6), which separate the metal plates from each other, and among which the metal plates are embedded, while having the metal plates face each other; and a through hole (8), which penetrates the laminated body, and which electrically connects the front and rear surfaces of the laminated body to each other. Each of the metal plates is provided with at least one machined hole (21) in the vicinity of the through hole.
(FR) La présente invention porte sur un substrat à noyau métallique présentant : un corps stratifié (7) conçu à partir d'une pluralité de plaques métalliques (3, 5), et une pluralité de couches de résine isolante (2, 4, 6), qui séparent les plaques métalliques les unes des autres, et parmi lesquelles les plaques métalliques sont incorporées, tout en ayant les plaques métalliques qui sont tournées les unes vers les autres ; et un trou traversant (8), qui pénètre le corps stratifié, et qui connecte électriquement les surfaces avant et arrière du corps stratifié l'une à l'autre. Chacune des plaques métalliques est pourvue d'au moins un trou usiné (21) à proximité du trou traversant.
(JA)  複数のメタルプレート(3、5)、及び前記複数のメタルプレートを対向させつつ離間するとともに埋設する複数の絶縁樹脂層(2、4、6)からなる積層体(7)と、前記積層体を貫通するとともに前記積層体の表裏面を電気的に接続するスルーホール(8)と、を有し、前記メタルプレートのそれぞれは、前記スルーホールの近傍に少なくとも1つの切削孔(21)を備えるメタルコア基板。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)