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1. (WO2017149740) SUBSTRATE TRAY FOR USE IN THIN-FILM FORMATION DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/149740 International Application No.: PCT/JP2016/056685
Publication Date: 08.09.2017 International Filing Date: 03.03.2016
IPC:
C23C 16/458 (2006.01) ,H01L 21/673 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
44
characterised by the method of coating
458
characterised by the method used for supporting substrates in the reaction chamber
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
673
using specially adapted carriers
Applicants:
コアテクノロジー株式会社 CORE TECHNOLOGY, INC. [JP/JP]; 埼玉県入間市木蓮寺1070番地2 1070-2, Mokurenji, Iruma-shi, Saitama 3580047, JP
株式会社アスカギ ASKAGI CORPORATION [JP/JP]; 福岡県福岡市中央区清川一丁目9番19号 5F 1-9-19 5F, Kiyokawa, Chuo-ku, Fukuoka-shi, Fukuoka 8100005, JP
Inventors:
吉村俊秋 YOSHIMURA Toshiaki; JP
箕輪裕之 MINOWA Hiroyuki; JP
石龍基 SHEK Lung Kei Amos; JP
Agent:
松尾憲一郎 MATSUO Kenichiro; JP
Priority Data:
Title (EN) SUBSTRATE TRAY FOR USE IN THIN-FILM FORMATION DEVICE
(FR) PLATEAU À SUBSTRAT DESTINÉ À ÊTRE UTILISÉ DANS UN DISPOSITIF DE FORMATION DE COUCHE MINCE
(JA) 薄膜形成装置に用いる基盤トレイ
Abstract:
(EN) Provided is a substrate tray which is to be used in a thin-film formation device and makes it easy to improve film quality and film thickness uniformity on a substrate by improving substrate heating efficiency and substrate heating uniformity. Thus, a substrate tray to be used in a thin-film formation device and characterized in that: the interior of an outer frame is substantially delimited into a grid pattern, by vertically and horizontally arranging partition frames having a substantially square frame inside the outer frame, and as a result, a substrate mounting space is formed that matches the approximate substrate shape; each of the partition frames is connected and supported by wires, by providing a plurality of wires between facing front- and rear-frame side frames of the outer frame; and furthermore, the substrate can be mounted on a substrate support part of a bottom-side partition frame joined to the bottom-floor surface of a top-side partition frame among the partition frames, or on the wires that transect the substrate mounting space.
(FR) La présente invention concerne un plateau à substrat qui est destiné à être utilisé dans un dispositif de formation de couche mince et qui permet d'améliorer facilement la qualité de la couche et l'uniformité de l'épaisseur de la couche sur un substrat par l'amélioration de l'efficacité du chauffage du substrat et de l'uniformité du chauffage du substrat. Ainsi, l'invention porte sur un plateau à substrat à utiliser dans un dispositif de formation de couche mince et caractérisé en ce que : l'intérieur d'un cadre externe est en grande partie délimité en un motif de grille, par la disposition verticale et horizontale de cadres de séparation ayant un cadre sensiblement carré à l'intérieur du cadre externe et, en conséquence, un espace de montage de substrat qui correspond à la forme approximative du substrat est formé ; chacun des cadres de séparation est relié et supporté par des fils, une pluralité de fils étant prévus entre les cadres du côté du cadre avant et du côté du cadre arrière du cadre externe se faisant face ; et en outre, le substrat peut être monté sur une partie de support de substrat d'un cadre de séparation du côté du fond uni à la surface de plancher inférieur d'un cadre de séparation du côté supérieur parmi les cadres de séparation ou sur les fils qui coupent l'espace de montage de substrat.
(JA) 基盤の加熱効率及び、基盤加熱の均一性を向上することにより、基盤への膜厚の均一性と膜質を向上させることを容易とした薄膜形成装置に用いる基盤トレイを提供する。 外枠内に、略四辺枠の仕切りフレームを縦横に架設して外枠内を略碁盤目状に区画することにより、略基盤形状に合致した基盤載置空間を形成すると共に、外枠の対向する前後枠辺フレーム間に複数のワイヤを架設して各仕切りフレームをワイヤにより連結支持し、しかも、基盤は仕切りフレームの上側仕切りフレームの下底面に接合した下側仕切りフレームの基盤支持部、又は基盤載置空間を横断するワイヤ上に載置可能としたことを特徴とする薄膜形成装置に用いる基盤トレイ。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)