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1. (WO2017149563) PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMATION METHOD AND CIRCUIT FORMATION SUBSTRATE IN WHICH SAID COMPOSITION IS USED
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/149563 International Application No.: PCT/JP2016/001139
Publication Date: 08.09.2017 International Filing Date: 02.03.2016
IPC:
G03F 7/037 (2006.01) ,G03F 7/029 (2006.01) ,G03F 7/031 (2006.01)
[IPC code unknown for G03F 7/037][IPC code unknown for G03F 7/029][IPC code unknown for G03F 7/031]
Applicants:
日立化成デュポンマイクロシステムズ株式会社 HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. [JP/JP]; 東京都文京区後楽一丁目4番25号 4-25, Koraku 1-chome, Bunkyo-ku, Tokyo 1120004, JP
Inventors:
松川 大作 MATSUKAWA, Daisaku; JP
谷本 明敏 TANIMOTO, Akitoshi; JP
榎本 哲也 ENOMOTO, Tetsuya; JP
Agent:
渡辺 喜平 WATANABE, Kihei; JP
Priority Data:
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMATION METHOD AND CIRCUIT FORMATION SUBSTRATE IN WHICH SAID COMPOSITION IS USED
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, ET PROCÉDÉ DE FORMATION DE MOTIF ET SUBSTRAT DE FORMATION DE CIRCUIT DANS LESQUELS LADITE COMPOSITION EST UTILISÉE
(JA) 感光性樹脂組成物、これを用いたパターン形成方法及び回路形成基板
Abstract:
(EN) Provided is a photosensitive resin composition containing (a) a polymer having structural units represented by formula (A), and (b) as compounds that produce radicals due to active light ray irradiation, the compound represented by formula (B) and the compound represented by formula (BB) (in formula (BB), R51 is either the group represented by formula (11) or the same group as R50).
(FR) L'invention concerne une composition de résine photosensible contenant (a) un polymère ayant des unités structurelles représentées par la formule (A), et (b) des composés qui produisent des radicaux sous l'effet d'un rayonnement lumineux actif étant représentés par la formule (B) et par la formule (BB) (dans la formule (BB), R51 est soit le groupe représenté par la formule (11) ou le même groupe que R50).
(JA)  (a)下記式(A)で表わされる構造単位を有するポリマー、並びに (b)活性光線照射によりラジカルを発生する化合物として、下記式(B)で表される化合物及び下記式(BB)で表される化合物(式(BB)中、R51は、式(11)で表される基、又はR50と同じの基である。)を含む、感光性樹脂組成物。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)