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1. (WO2017149521) MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

Pub. No.:    WO/2017/149521    International Application No.:    PCT/IB2017/051297
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Tue Mar 07 00:59:59 CET 2017
IPC: H01L 21/70
B81C 1/00
H01L 31/18
H01L 33/00
H01L 51/48
H01L 51/56
Applicants: VUEREAL INC.
Inventors: CHAJI, Gholamreza
FATHI, Ehsanallah
Title: MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Abstract:
Post-processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structures such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. Dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with transferred micro devices. Color conversion layers may be integrated into the system substrate to create different outputs from the micro devices.