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1. (WO2017149426) ELECTRONIC DEVICE AND METHOD OF MAKING THE SAME USING SURFACE MOUNT TECHNOLOGY AND AN ANISOTROPIC CONDUCTIVE ADHESIVE USEFUL IN THE METHOD
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Pub. No.: WO/2017/149426 International Application No.: PCT/IB2017/051112
Publication Date: 08.09.2017 International Filing Date: 27.02.2017
IPC:
H05K 3/32 (2006.01) ,H01L 21/60 (2006.01) ,C09J 9/02 (2006.01) ,H05K 13/04 (2006.01) ,H01L 21/68 (2006.01) ,H05K 1/18 (2006.01) ,H01L 23/538 (2006.01) ,H01L 25/16 (2006.01) ,H01L 21/66 (2006.01) ,H01L 21/67 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04
Mounting of components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68
for positioning, orientation or alignment
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
52
Arrangements for conducting electric current within the device in operation from one component to another
538
the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16
the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Applicants:
THIN FILM ELECTRONICS ASA [NO/NO]; Henrik Ibsens gate 100 0255 Oslo, NO
Inventors:
HAGEL, Olle; SE
Agent:
MAHAN, Theresa; US
FORTNEY, Andrew; US
Priority Data:
62/301,24329.02.2016US
Title (EN) ELECTRONIC DEVICE AND METHOD OF MAKING THE SAME USING SURFACE MOUNT TECHNOLOGY AND AN ANISOTROPIC CONDUCTIVE ADHESIVE USEFUL IN THE METHOD
(FR) DISPOSITIF ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION FAISANT APPEL À UNE TECHNOLOGIE DE MONTAGE EN SURFACE ET ADHÉSIF CONDUCTEUR ANISOTROPE UTILE DANS LEDIT PROCÉDÉ
Abstract:
(EN) A method of and system (200) for manufacturing an electronic device (300, 300'), a curable conductive adhesive for use in the same, and an electronic device (300, 300') are disclosed. The method includes printing a conductive adhesive onto pads at ends of traces on a substrate (310, 360), placing one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape (e.g. circular, oval or rectangular with rounded corners) onto the pads with the conductive adhesive thereon, and after the component(s) (320, 340, 340', 350, 355) have been placed onto the pads, curing the conductive adhesive at a predetermined temperature or with light having a predetermined wavelength (band). The one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape may be an antenna (320), a sensor (340, 340') and/or a display (350, 355). The electronic device (300, 300') may further comprise one or more additional components (330, 335, 370) having a standard size and/or shape on a second subset of the pads. The additional components (330, 335, 370) may be an integrated circuit (330, 335) and/or a battery (370). The system (200) comprises a printer (220) configured to print a conductive adhesive onto pads at ends of traces on a substrate, a surface mounting (SMT) machine (230) configured to place one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and a curing station configured to cure the conductive adhesive after the component(s) (320, 340, 340', 350, 355) have been placed onto the pads. The SMT machine (230) may include a nozzle head having a surface with a shape identical to or configured to match a shape of the component (320, 340, 340', 350, 355) it picks up.
(FR) La présente invention concerne un procédé et un système (200) de fabrication d'un dispositif électronique (300, 300'), un adhésif conducteur durcissable destiné à être utilisé dans celui-ci, et un dispositif électronique (300, 300'). Le procédé comprend l'impression d'un adhésif conducteur sur des plages à des extrémités de traces sur un substrat (310, 360), le placement d'un ou de plusieurs composants (320, 340, 340', 350, 355) qui présentent une taille et/ou une forme non standard (par exemple, une forme circulaire, ovale ou rectangulaire avec des coins arrondis) sur les plages avec l'adhésif conducteur sur celles-ci, et après que le ou les composants (320, 340, 340', 350, 355) ont été placés sur les plages, le durcissement de l'adhésif conducteur à une température prédéterminée ou avec une lumière qui présente une longueur d'onde (bande) prédéterminée. Le ou les composants (320, 340, 340', 350, 355) présentant une taille et/ou une forme non standard peuvent être une antenne (320), un capteur (340, 340') et/ou un afficheur (350, 355). Le dispositif électronique (300, 300') peut en outre comprendre un ou plusieurs composants additionnels (330, 335, 370) ayant une taille et/ou une forme standard sur un second sous-ensemble des plages. Les composants additionnels (330, 335, 370) peuvent être un circuit intégré (330, 335) et/ou une pile (370). Le système (200) comprend une imprimante (220) conçue pour imprimer un adhésif conducteur sur des plages à des extrémités de traces sur un substrat, une machine de montage en surface (MT) (230) conçue pour placer un ou plusieurs composants (320, 340, 340', 350, 355) qui présentent une taille et/ou une forme non standard sur les plages avec l'adhésif conducteur sur celles-ci, et un poste de durcissement conçu pour durcir l'adhésif conducteur après que le ou les composants (320, 340, 340', 350, 355) ont été placés sur les plages. La machine MT (230) peut comporte une tête de buse ayant une surface dont la forme est identique ou qui est conçue pour se coupler à la forme d'un composant (320, 340, 340', 350, 355) qu'elle saisit.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)