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1. (WO2017148901) A CIRCUIT LAYER FOR AN INTEGRATED CIRCUIT CARD

Pub. No.:    WO/2017/148901    International Application No.:    PCT/EP2017/054576
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Wed Mar 01 00:59:59 CET 2017
IPC: G06K 19/077
Applicants: CARDLAB APS
Inventors: NIELSEN, Finn
Title: A CIRCUIT LAYER FOR AN INTEGRATED CIRCUIT CARD
Abstract:
A circuit layer for an integrated circuit card comprising an electronic circuit embedded in a substrate and a coating covering the substrate and circuit. To enable larger tolerances of the position of the circuit in the substrate, the electronic circuit has contact pads with a quadrangular shape and the contact pads are exposed through the coating by holes having a circular shape.