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1. (WO2017148873) COMPOSITE WAFER, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Pub. No.:    WO/2017/148873    International Application No.:    PCT/EP2017/054530
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Tue Feb 28 00:59:59 CET 2017
IPC: H01L 21/78
H01L 21/56
Applicants: INFINEON TECHNOLOGIES AG
Inventors: FEIL, Thomas
GANITZER, Paul
LACKNER, Gerald
MUELLER, Jochen
POELZL, Martin
POLSTER, Tobias
VON KOBLINSKI, Carsten
Title: COMPOSITE WAFER, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Abstract:
In an embodiment, a method includes forming at least one trench in non-device regions of a first surface of a semiconductor wafer, the non-device regions being arranged between component positions, the component positions including device regions and a first metallization structure, applying a first polymer layer to the first surface of a semiconductor wafer such that the trenches and edge regions of the component positions are covered with the first polymer layer and such that at least a portion of the first metallization structure is uncovered by the first polymer layer, removing portions of a second surface of the semiconductor wafer, the second surface opposing the first surface, revealing portions of the first polymer layer in the non-device regions and producing a worked second surface and inserting a separation line through the first polymer layer in the non-device regions to form a plurality of separate semiconductor dies.