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1. (WO2017148775) CSP LED MODULE HAVING IMPROVED LIGHT EMISSION
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Pub. No.: WO/2017/148775 International Application No.: PCT/EP2017/054099
Publication Date: 08.09.2017 International Filing Date: 22.02.2017
IPC:
H01L 25/075 (2006.01) ,H01L 33/52 (2010.01) ,H01L 33/50 (2010.01) ,H01L 33/48 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
50
Wavelength conversion elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
Applicants:
TRIDONIC JENNERSDORF GMBH [AT/AT]; Technologiepark 10 8380 Jennersdorf, AT
Inventors:
DOBOS, Janos; HU
RIEMER, Steffen; AT
SZÜCS, Anna; AT
GRUENDLING, Vladimir; AT
Agent:
BARTH, Alexander; AT
ECKBAUER, Verena; AT
Priority Data:
10 2016 203 162.729.02.2016DE
Title (EN) CSP LED MODULE HAVING IMPROVED LIGHT EMISSION
(FR) MODULE DE LED CSP À ÉMISSION DE LUMIÈRE AMÉLIORÉE
(DE) CSP LED MODUL MIT VERBESSERTER LICHTEMISSION
Abstract:
(EN) The invention relates to an LED module (10) having a carrier (1) and at least two LED components (2) arranged on a surface (1a) of the carrier, wherein the LED components (2) are each LED chips (2a) individually surrounded by a casting compound (2b), wherein the LED components (2) are arranged with the formation of an intermediate space (4) between two opposing side surfaces (2d) of the LED components (2), and a transparent cover (3) arranged over the LED components (2), which covers the at least two LED components (2) and at least partially fills the intermediate space (4) between the LED components (2), and wherein the cover (3) consists of a material having a substantially equal refractive index or index of refraction to the individual casting compound (2b) of the LED chips (2a), and wherein the carrier is a circuit board and the LED components (2) are chip-scale package (CSP) LEDs.
(FR) L’invention concerne un module de LED (10) comprenant un support (1) et au moins deux composants LED (2) disposés sur une surface (1a) du support. Les composants LED (2) sont chacun des puces de LED (2a) enrobées individuellement d’une matière de scellement (2b). Les composants LED (2) sont disposés de façon à former un espace intermédiaire (4) entre deux faces latérales (2d), opposées l’une à l’autre, des composants LED (2). Le module de LED comprend également un revêtement transparent (3) qui recouvre les au moins deux composants LED (2) et qui remplit au moins partiellement l’espace intermédiaire (4) entre les composants LED (2). Le revêtement (3) est constitué d’une matière ayant un indice de réfraction sensiblement identique à celui de la matière de scellement individuelle (2b) des puces de LED (2a). Le support est une carte de circuit imprimé et les composants LED (2) sont des LED à boîtier-puce (CSP).
(DE) Die Erfindung betrifft ein LED Modul (10) aufweisend einen Träger (1) und wenigstens zwei auf einer Oberfläche (la) des Trägers angeordnete LED Bauelemente (2), wobei die LED Bauelemente (2) jeweils individuell mit einer Vergussmasse (2b) umschlossene LED Chips (2a) sind, wobei die LED Bauelemente (2) unter Ausbildung eines Zwischenraums (4) zwischen zwei sich jeweils gegenüberliegenden Seitenflächen (2d) der LED Bauelemente (2) angeordnet sind, und eine über den LED Bauelementen (2) angeordnete transparente Abdeckung (3), welche die wenigstens zwei LED Bauelemente (2) abdeckt und den Zwischenraum (4) zwischen den LED Bauelementen (2) wenigstens teilweise ausfüllt und wobei die Abdeckung (3) aus einem Material besteht, welches eine im Wesentlichen gleiche Brechzahl bzw. Brechungsindex wie die individuelle Vergussmasse (2b) der LED Chips (2a) aufweist, und wobei der Träger eine Leiterplatte ist und die LED Bauelemente (2) „Chip Scale Package" (CSP) LEDs sind.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)