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1. (WO2017148685) CONNECTION CARRIER, OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING A CONNECTION CARRIER OR AN OPTOELECTRONIC COMPONENT
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Pub. No.: WO/2017/148685 International Application No.: PCT/EP2017/053030
Publication Date: 08.09.2017 International Filing Date: 10.02.2017
IPC:
H01L 33/44 (2010.01) ,H01L 33/62 (2010.01) ,H01L 33/48 (2010.01) ,H01L 33/54 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
44
characterised by the coatings, e.g. passivation layer or anti-reflective coating
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
54
having a particular shape
Applicants:
OSRAM OPTO SEMICONDUCTORS GMBH [DE/DE]; Leibnizstr. 4 93055 Regensburg, DE
HERAEUS DEUTSCHLAND GMBH & CO. KG [DE/DE]; Heraeusstr. 12 - 14 63450 Hanau, DE
Inventors:
DITZEL, Eckhard; DE
KLAJIC, Tihomir; DE
WINDISCH, Reiner; DE
BIEBERSDORF, Andreas; DE
Agent:
EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH; Schloßschmidstr. 5 80639 München, DE
Priority Data:
10 2016 103 819.903.03.2016DE
Title (EN) CONNECTION CARRIER, OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING A CONNECTION CARRIER OR AN OPTOELECTRONIC COMPONENT
(FR) SUPPORT DE CONNEXION, COMPOSANT OPTOÉLECTRONIQUE ORGANIQUE, ET PROCÉDÉ DE FABRICATION D'UN SUPPORT DE CONNEXION OU D'UN COMPOSANT OPTOÉLECTRONIQUE
(DE) ANSCHLUSSTRÄGER, OPTOELEKTRONISCHES BAUTEIL UND VERFAHREN ZUR HERSTELLUNG EINES ANSCHLUSSTRÄGERS ODER EINES OPTOELEKTRONISCHEN BAUTEILS
Abstract:
(EN) Disclosed is a connection carrier, wherein: an insulation element (13) is arranged on the side of a contact element (12) facing away from a connection element (11); the connection element (11) projects laterally beyond the contact element (12); the insulation element (13) covers a contact element cover surface (12a) of the contact element (12), said surface facing away from the connection element (11) and also covers a contact element lateral surface (12c) of the contact element, said surface facing the lateral substrate surface (10c) of a substrate (10); a substrate cover surface (10a) of the substrate (10) is freely accessible in a central region (18), and the central region (18) is surrounded laterally by the insulation element (13).
(FR) L'invention concerne un support de connexion, présentant les caractéristiques suivantes : - un élément isolant (13) est disposé sur une face d'un élément de contact (12), opposée à un élément de connexion (11), - l'élément de connexion (11) fait saillie latéralement par rapport à l'élément de contact (12), - l'élément isolant (13) recouvre l'élément de contact (12) sur une face de recouvrement d'élément de contact (12a), opposée à l'élément de connexion (11) et sur une face latérale d'élément de contact (12c), orientée vers la face latérale (10c) d'un substrat (10), - une face de recouvrement (10a) du substrat (10) est librement accessible dans une zone centrale (18), - et la dite zone centrale (18) est entourée latéralement par l'élément isolant (13).
(DE) Es wird ein Anschlussträger angegeben, bei dem -ein Isolationselement (13) an der einem Verbindungselement (11) abgewandten Seite eines Kontaktelements (12) angeordnet ist, -das Verbindungselement (11) das Kontaktelement (12) seitlich überragt, -das Isolationselement (13) das Kontaktelement (12) an einer dem Verbindungselement (11) abgewandten Kontaktelement- Deckfläche (12a) und einer der Substrat-Seitenfläche (10c) eines Substrats (10) zugewandten Kontaktelement-Seitenfläche (12c) bedeckt, -eine Substrat-Deckfläche (10a) des Substrats (10) in einem Zentralbereich (18) frei zugänglich ist, und -der Zentralbereich (18) seitlich vom Isolationselement (13) umgeben ist.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)