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1. (WO2017148353) FLIP CHIP BONDING DEVICE AND BONDING METHOD

Pub. No.:    WO/2017/148353    International Application No.:    PCT/CN2017/075033
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Tue Feb 28 00:59:59 CET 2017
IPC: H01L 21/60
H01L 21/683
H01L 21/67
Applicants: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
上海微电子装备(集团)股份有限公司
Inventors: CHEN, Feibiao
陈飞彪
GE, Yaping
戈亚萍
GUO, Song
郭耸
QI, Jingchao
齐景超
Title: FLIP CHIP BONDING DEVICE AND BONDING METHOD
Abstract:
Disclosed is a flip chip bonding device and a bonding method. The bonding device comprises: a supply unit (10) configured to separate a flip chip (200) from a slide (100) and to provide the flip chip (200), and comprising a flipping device (11); a transfer unit (20) configured to receive the flip chip (200) from the flipping device (11); a position adjustment unit (30) configured to adjust the position of the flip chip (200) on the transfer unit (20); a bonding unit (40) configured to bond the flip chip (200) on the transfer unit (20) to a substrate (400); a transport unit (50) configured to transport the transfer unit (20); and a control unit (60) configured to control the movement of each of the units. Since the transfer unit (20) can handle multiple flip chips (200), the present invention can complete bonding of multiple flip chips (200) at one time, thereby saving bonding time and increasing bonding efficiency. In addition, the transfer unit (20) passes through the position adjustment unit (30) during transport, and the position adjustment unit (30) adjusts the position of the flip chip (200) on the transfer unit (20) so as to ensure accurate positioning of the flip chip (200) during the subsequent bonding process, achieving highly accurate bonding.