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|1. (WO2017148127) HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING SAME|
|Applicants:||SHENGYI TECHNOLOGY CO.,LTD.
|Title:||HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING SAME|
Disclosed are a halogen-free thermosetting resin composition and a prepreg and a laminate for printed circuits using same. The halogen-free thermosetting resin composition contains, based on 100 parts by weight of organic solids, (A) 16-42 parts by weight of a halogen-free epoxy resin, (B) 1.5-4.8 parts by weight of a compound having a dihydrobenzoxazine ring, (C) 10-28 parts by weight of a phosphorus-containing bisphenol curing agent, the weight average molecular weight of the phosphorus-containing bisphenol is 1000-6500, and (D) 30-70 parts by weight of silicon dioxide. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition have a high glass transition temperature, excellent dielectric properties, low water absorption, a high thermal resistance and a good processability, and can achieve halogen-free flame retardancy, which can reach UL94 V-0 grade.