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1. (WO2017148127) HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING SAME

Pub. No.:    WO/2017/148127    International Application No.:    PCT/CN2016/098449
Publication Date: Sat Sep 09 01:59:59 CEST 2017 International Filing Date: Fri Sep 09 01:59:59 CEST 2016
IPC: C08L 63/00
C08G 59/32
C08K 5/357
C08G 59/62
C08K 3/36
B32B 15/092
B32B 27/18
B32B 33/00
Applicants: SHENGYI TECHNOLOGY CO.,LTD.
广东生益科技股份有限公司
Inventors: YOU, Jiang
游江
HUANG, Tianhui
黄天辉
XU, Yongjing
许永静
YANG, Zhongqiang
杨中强
Title: HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING SAME
Abstract:
Disclosed are a halogen-free thermosetting resin composition and a prepreg and a laminate for printed circuits using same. The halogen-free thermosetting resin composition contains, based on 100 parts by weight of organic solids, (A) 16-42 parts by weight of a halogen-free epoxy resin, (B) 1.5-4.8 parts by weight of a compound having a dihydrobenzoxazine ring, (C) 10-28 parts by weight of a phosphorus-containing bisphenol curing agent, the weight average molecular weight of the phosphorus-containing bisphenol is 1000-6500, and (D) 30-70 parts by weight of silicon dioxide. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition have a high glass transition temperature, excellent dielectric properties, low water absorption, a high thermal resistance and a good processability, and can achieve halogen-free flame retardancy, which can reach UL94 V-0 grade.