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1. (WO2017139353) TEMPERATURE SENSING SYSTEM FOR ROTATABLE WAFER SUPPORT ASSEMBLY
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/139353 International Application No.: PCT/US2017/016975
Publication Date: 17.08.2017 International Filing Date: 08.02.2017
IPC:
G01K 1/02 (2006.01)
G PHYSICS
01
MEASURING; TESTING
K
MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
1
Details of thermometers not specially adapted for particular types of thermometer
02
Special applications of indicating or recording means, e.g. for remote indications
Applicants:
WATLOW ELECTRIC MANUFACTURING COMPANY [US/US]; 12001 Lackland Road St. Louis, MO 63146, US
Inventors:
NOSRATI, Mohammad; US
TOMPKINS, Timothy, B.; US
Agent:
BURRIS, Kelly, K.; US
Priority Data:
62/292,61408.02.2016US
Title (EN) TEMPERATURE SENSING SYSTEM FOR ROTATABLE WAFER SUPPORT ASSEMBLY
(FR) SYSTÈME DE DÉTECTION DE TEMPÉRATURE POUR ENSEMBLE SUPPORT DE TRANCHE ROTATIF
Abstract:
(EN) A semiconductor processing apparatus includes a wafer support assembly, a temperature sensor integrated in the wafer support assembly for measuring a temperature of the wafer support assembly, and a signal transmission device that wirelessly transmits a signal relating to a temperature measurement obtained by the temperature sensor to an external control module.
(FR) La présente invention concerne un appareil de traitement de semi-conducteur comprenant un ensemble support de tranche, un capteur de température intégré à l'ensemble support de tranche pour mesurer la température de l'ensemble support de tranche, et un dispositif de transmission de signal qui transmet sans fil un signal concernant une mesure de température obtenue par le capteur de température à un module de commande externe.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020180114088CN108885139EP3414541