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1. (WO2017139079) IN-SITU TEMPERATURE CONTROL DURING CHEMICAL MECHANICAL POLISHING WITH A CONDENSED GAS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/139079 International Application No.: PCT/US2017/014105
Publication Date: 17.08.2017 International Filing Date: 19.01.2017
IPC:
B24B 49/14 (2006.01) ,B24B 37/04 (2012.01) ,B24B 37/34 (2012.01) ,B24B 49/08 (2006.01) ,B24B 57/02 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49
Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
14
taking regard of the temperature during grinding
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
04
designed for working plane surfaces
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
34
Accessories
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49
Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
08
involving liquid or pneumatic means
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
57
Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
02
for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Applicants:
APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054, US
Inventors:
BROWN, Brian J.; US
Agent:
PATTERSON, B. Todd; US
TACKETT, Keith M.; US
Priority Data:
62/294,42012.02.2016US
Title (EN) IN-SITU TEMPERATURE CONTROL DURING CHEMICAL MECHANICAL POLISHING WITH A CONDENSED GAS
(FR) RÉGULATION DE TEMPÉRATURE IN-SITU PENDANT UN POLISSAGE CHIMIQUE-MÉCANIQUE À L'AIDE D'UN GAZ CONDENSÉ
Abstract:
(EN) Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the same. More specifically, implementations of the present disclosure relate to in-situ temperature control with a condensed gas during a chemical-mechanical polishing (CMP) process. In one implementation, the method comprises polishing one or more substrates against a polishing surface in the presence of a polishing fluid during a polishing process to remove a portion of a material formed on the one or more substrates. A temperature of the polishing surface is monitored during the polishing process. Carbon dioxide snow is delivered to the polishing surface in response to the monitored temperature to maintain the temperature of the polishing surface at a target value during the polishing process.
(FR) Des modes de réalisation de la présente invention concernent de manière générale l'aplanissement de surfaces sur des substrats et sur des couches formées sur des substrats, y compris un appareil de régulation de température in-situ pendant le polissage, et des procédés d'utilisation de ce dernier. Plus spécifiquement, des modes de réalisation de la présente invention concernent la régulation de température in-situ avec un gaz condensé pendant un processus de polissage chimique-mécanique (CMP). Dans un mode de réalisation, le procédé consiste à polir un ou plusieurs substrats contre une surface de polissage en présence d'un fluide de polissage pendant un processus de polissage pour éliminer une partie d'un matériau formé sur le ou les substrats. Une température de la surface de polissage est surveillée pendant le processus de polissage. La neige de dioxyde de carbone est fournie à la surface de polissage en réponse à la température surveillée afin maintenir la température de la surface de polissage à une valeur cible pendant le processus de polissage.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)