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1. (WO2017138987) SPUTTERING DEVICE COMPONENT WITH MODIFIED SURFACE AND METHOD OF MAKING
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/138987 International Application No.: PCT/US2016/054813
Publication Date: 17.08.2017 International Filing Date: 30.09.2016
IPC:
C23C 14/34 (2006.01) ,H01J 37/34 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
34
operating with cathodic sputtering
Applicants:
HONEYWELL INTERNATIONAL INC. [US/US]; Intellectual Property-Patent Services 115 Tabor Road, M/S 4D3 P.O. Box 377 Morris Plains, New Jersey 07950, US
Inventors:
KIM, Jaeyeon; US
UNDERWOOD, Patrick K; US
STROTHERS, Susan D.; US
PAYTON, Michael D.; US
SAYLES, Scott R.; US
Agent:
CONNOR, Jeffrey; US
BARTA, Daniel J.; US
Priority Data:
15/261,23009.09.2016US
62/293,24509.02.2016US
Title (EN) SPUTTERING DEVICE COMPONENT WITH MODIFIED SURFACE AND METHOD OF MAKING
(FR) COMPOSANT DE DISPOSITIF DE PULVÉRISATION À SURFACE MODIFIÉE ET PROCÉDÉ DE RÉALISATION
Abstract:
(EN) A sputtering target assembly for use in a vapor deposition apparatus, the sputtering target assembly comprising a sputtering surface; a sidewall extending from the sputtering surface at an angle to the sputtering surface; a particle trap formed of a roughness located along the sidewall and extending radially from the sputtering surface, wherein the roughness of the particle trap has a macrostructure and a microstructure.
(FR) L'invention concerne un ensemble cible de pulvérisation destiné à être utilisé dans un appareil de dépôt en phase vapeur, l'ensemble cible de pulvérisation comprenant une surface de pulvérisation ; une paroi latérale s'étendant de la surface de pulvérisation en formant un angle avec la surface de pulvérisation ; un piège à particules constitué d'une rugosité située le long de la paroi latérale et s'étendant radialement à partir de la surface de pulvérisation, la rugosité du piège à particules présentant une macrostructure et une microstructure.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020180104167