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1. (WO2017138773) SECURITY SEMICONDUCTOR CHIP AND METHOD FOR OPERATING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/138773 International Application No.: PCT/KR2017/001491
Publication Date: 17.08.2017 International Filing Date: 10.02.2017
IPC:
G06F 21/57 (2013.01) ,G06F 21/55 (2013.01) ,G06F 15/78 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
21
Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
50
Monitoring users, programs or devices to maintain the integrity of platforms, e.g. of processors, firmware or operating systems
57
Certifying or maintaining trusted computer platforms, e.g. secure boots or power-downs, version controls, system software checks, secure updates or assessing vulnerabilities
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
21
Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
50
Monitoring users, programs or devices to maintain the integrity of platforms, e.g. of processors, firmware or operating systems
55
Detecting local intrusion or implementing counter-measures
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
15
Digital computers in general; Data processing equipment in general
76
Architectures of general purpose stored programme computers
78
comprising a single central processing unit
Applicants:
한양대학교 산학협력단 INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY [KR/KR]; 서울시 성동구 왕십리로 222 222, Wangsimni-ro Seongdong-gu Seoul 15588, KR
Inventors:
고형호 KO, Hyoung Ho; KR
최병덕 CHOI, Byong Deok; KR
Agent:
민영준 MIN, Young Joon; KR
Priority Data:
10-2016-001658712.02.2016KR
10-2017-001869210.02.2017KR
Title (EN) SECURITY SEMICONDUCTOR CHIP AND METHOD FOR OPERATING SAME
(FR) PUCE À SEMICONDUCTEUR DE SÉCURITÉ ET PROCÉDÉ D'UTILISATION ASSOCIÉ
(KO) 보안 반도체 칩 및 그 동작 방법
Abstract:
(EN) Disclosed is a security semiconductor chip. When a physical attack such as a depackaging attack occurs, the semiconductor chip can detect the physical attack. A semiconductor chip according to one embodiment comprises an energy harvesting element inside a package. The energy harvesting element may comprise, for example, an on-chip photodiode. A depackaging attack causes the generation of a voltage of a photodiode, and thus a change in physical state of the packaging can be detected.
(FR) L'invention concerne une puce à semi-conducteur de sécurité. Lorsqu'une attaque physique, telle qu'une attaque de déballage se produit, la puce à semi-conducteur peut détecter l'attaque physique. Selon un mode de réalisation, une puce à semi-conducteur comprend un élément de collecte d'énergie à l'intérieur d'un emballage. Par exemple, l'élément de collecte d'énergie peut comprendre une photodiode sur puce. Une attaque de déballage provoque la génération d'une tension d'une photodiode, ce qui permet de détecter un changement d'état physique de l'emballage.
(KO) 보안 반도체 칩이 제시된다. 반도체 칩은 디패키징과 같은 물리적 공격이 있는 경우 이를 감지할 수 있다. 일실시예에 따르면 반도체 칩은 패키지 내에 에너지 하베스팅 소자를 포함한다. 예시적으로 에너지 하베스팅 소자는 온-칩 포토 다이오드를 포함할 수 있다. 디패키징 공격은 포토 다이오드의 전압 생성을 야기하므로 패키징에 대한 물리적 상태 변화가 감지될 수 있다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)
Also published as:
CN108701192US20190050702