Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017138684) LASER PROCESSING SYSTEM
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/138684 International Application No.: PCT/KR2016/010051
Publication Date: 17.08.2017 International Filing Date: 08.09.2016
IPC:
B23K 26/00 (2014.01) ,B23K 26/03 (2006.01) ,B23K 26/08 (2014.01) ,B23K 26/36 (2014.01) ,B23K 26/70 (2014.01) ,B23Q 17/24 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
03
Observing the workpiece
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
08
Devices involving relative movement between laser beam and workpiece
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
[IPC code unknown for B23K 26/70]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
Q
DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL, CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
17
Arrangements for indicating or measuring on machine tools
24
using optics
Applicants:
(주)이오테크닉스 EO TECHNICS CO.,LTD. [KR/KR]; 경기도 안양시 동안구 동편로 91 91, Dongpyeon-ro Dongan-gu, Anyang-si, Gyeonggi-do 13930, KR
Inventors:
이용우 LEE, Yong Woo; KR
허진 HUR, Jeen; KR
최영준 CHOI, Young Jun; KR
신동수 SHIN, Dong Soo; KR
이준영 LEE, Jun Young; KR
김유석 KIM, Yoo Suk; KR
조규환 CHO, Kyu Hwan; KR
정현택 JUNG, Hyun Taek; KR
Agent:
리앤목 특허법인 Y.P.LEE, MOCK & PARTNERS; 서울시 강남구 언주로 30길 13 대림아크로텔 12층 12F Daelim Acrotel, 13 Eonju-ro 30-gil Gangnam-gu, Seoul 06292, KR
Priority Data:
10-2016-001635712.02.2016KR
Title (EN) LASER PROCESSING SYSTEM
(FR) SYSTÈME DE TRAITEMENT LASER
(KO) 레이저 가공 시스템
Abstract:
(EN) A laser processing system is disclosed. The disclosed laser processing system comprises: a detection unit for detecting a thickness of a workpiece in an optical manner; a laser irradiation unit for irradiating a laser beam onto the workpiece on the basis of the thickness detected by the detection unit; and a cooling unit configured to cool the detection unit.
(FR) L'invention concerne un système de traitement laser. Le système de traitement laser décrit comprend : une unité de détection destinée à détecter une épaisseur d'une pièce de manière optique ; une unité de rayonnement laser pour exposer la pièce à un faisceau laser sur la base de l'épaisseur détectée par l'unité de détection ; et une unité de refroidissement conçue pour refroidir l'unité de détection.
(KO) 레이저 가공 시스템이 개시된다. 개시된 레이저 가공 시스템은, 광학 방식에 의해 가공 대상물의 두께를 검출하는 검출 유닛; 상기 검출 유닛에 의해 검출된 두께에 기초하여, 상기 가공 대상물에 레이저 빔을 조사하는 레이저 조사 유닛; 및 상기 검출 유닛을 냉각시키도록 구성된 냉각 유닛;을 포함한다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)