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1. (WO2017138380) INSPECTION JIG, INSPECTION JIG SET, AND SUBSTRATE INSPECTION DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/138380 International Application No.: PCT/JP2017/003115
Publication Date: 17.08.2017 International Filing Date: 30.01.2017
IPC:
G01R 1/073 (2006.01) ,G01R 31/02 (2006.01) ,G01R 31/26 (2014.01) ,G01R 31/28 (2006.01) ,H05K 3/00 (2006.01)
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
06
Measuring leads; Measuring probes
067
Measuring probes
073
Multiple probes
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
02
Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26
Testing of individual semiconductor devices
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28
Testing of electronic circuits, e.g. by signal tracer
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
Applicants:
日本電産リード株式会社 NIDEC-READ CORPORATION [JP/JP]; 京都府京都市右京区西京極堤外町10 10, Tsutsumisoto-cho, Nishikyogoku, Ukyo-ku, Kyoto-shi, Kyoto 6150854, JP
Inventors:
松川 俊英 MATSUKAWA Toshihide; JP
北澤 一孝 KITAZAWA Kazutaka; JP
中山 孝文 NAKAYAMA Takafumi; JP
辻本 正之 TSUJIMOTO Masayuki; JP
高橋 正 TAKAHASHI Tadashi; JP
角田 晴美 KADOTA Harumi; JP
楠田 達文 KUSUDA Tatsufumi; JP
Agent:
柳野 隆生 YANAGINO Takao; JP
森岡 則夫 MORIOKA Norio; JP
関口 久由 SEKIGUCHI Hisayoshi; JP
大西 裕人 OHNISHI Hiroto; JP
Priority Data:
2016-02433012.02.2016JP
Title (EN) INSPECTION JIG, INSPECTION JIG SET, AND SUBSTRATE INSPECTION DEVICE
(FR) MONTAGE D'INSPECTION, ENSEMBLE DE MONTAGES D'INSPECTION ET DISPOSITIF D'INSPECTION DE SUBSTRATS
(JA) 検査治具、検査治具セット、及び基板検査装置
Abstract:
(EN) [Problem] To provide an inspection jig, an inspection jig set, and a substrate inspection device capable of shortening inspection time while temperature stress is applied to a substrate to be inspected. [Solution] An inspection jig (3D) for inspecting a substrate (100) in which an inspection point (P1) to be inspected is set, wherein the inspection jig (3D) is provided with a probe (Pr) for making contact with the inspection point (P1), and a heating block (35D) having a contact surface (B1) for making contact with the substrate (100), the heating block (35D) heating the substrate (100) by heating the contact surface (B1).
(FR) [Problème] L'invention a pour objet de proposer un montage d'inspection, un ensemble de montages d'inspection et un dispositif d'inspection de substrats capables de raccourcir le temps d'inspection tandis qu'une contrainte de température est appliquée à un substrat à inspecter. [Solution] Un montage (3D) d'inspection destiné à inspecter un substrat (100) dans lequel est défini un point (P1) d'inspection à inspecter, le montage (3D) d'inspection étant muni d'une sonde (Pr) destinée à entrer en contact avec le point (P1) d'inspection, et un bloc (35D) de chauffage présentant une surface (B1) de contact destinée à entrer en contact avec le substrat (100), le bloc (35D) de chauffage chauffant le substrat (100) en chauffant la surface (B1) de contact.
(JA) 【課題】検査対象の基板に温度ストレスをかけつつ検査時間を短縮することができる検査治具、検査治具セット、及び基板検査装置を提供する。 【解決手段】検査治具3Dは、検査対象の検査点P1が設定された基板100を検査するための検査治具3Dであって、検査点P1に接触するためのプローブPrと、基板100に接触するための接触面B1を有し、接触面B1を加熱することにより基板100を加熱する加熱ブロック35Dとを備えた。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)