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1. (WO2017138350) GLASS INTERPOSER MODULE, IMAGE CAPTURE DEVICE, AND ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/138350 International Application No.: PCT/JP2017/002420
Publication Date: 17.08.2017 International Filing Date: 25.01.2017
IPC:
H01L 27/14 (2006.01) ,H01L 23/15 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
14
characterised by the material or its electrical properties
15
Ceramic or glass substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
ソニー株式会社 SONY CORPORATION [JP/JP]; 東京都港区港南1丁目7番1号 1-7-1, Konan, Minato-ku, Tokyo 1080075, JP
Inventors:
橋本 光生 HASHIMOTO Mitsuo; JP
秋葉 朗 AKIBA Akira; JP
椛澤 秀年 KABASAWA Hidetoshi; JP
Agent:
西川 孝 NISHIKAWA Takashi; JP
稲本 義雄 INAMOTO Yoshio; JP
Priority Data:
2016-02153608.02.2016JP
Title (EN) GLASS INTERPOSER MODULE, IMAGE CAPTURE DEVICE, AND ELECTRONIC DEVICE
(FR) MODULE INTERCALAIRE EN VERRE, DISPOSITIF DE CAPTURE D'IMAGES ET DISPOSITIF ÉLECTRONIQUE
(JA) ガラスインタポーザモジュール、撮像装置、および電子機器
Abstract:
(EN) The present disclosure relates to a glass interposer module with which the development of distortion due to thermal expansion during manufacturing can be reduced, an image device, and an electronic device. Between the glass interposer and a CMOS image sensor (CIS), a light-transmissive member is filled. This makes it possible to increase the rigidity of the glass interposer, whereby warping of the CIS can be suppressed and the influence of distortion on a gyro sensor and the like mounted on the glass interposer can be decreased. Accordingly, erroneous detection of a gyro signal can be decreased. The present disclosure may be applied in a glass interposer module.
(FR) La présente invention concerne un module intercalaire en verre qui permet de réduire l'apparition de distorsion due à la dilatation thermique pendant la fabrication, un dispositif d'image et un dispositif électronique. Un élément de transmission de lumière est rempli entre l'intercalaire en verre et un capteur d'image CMOS (CIS). Ceci permet d'améliorer la rigidité de l'intercalaire en verre, supprimant ainsi la déformation du CIS et de réduire l'effet de distorsion sur un capteur gyroscopique et similaire monté sur l'intercalaire en verre. Par conséquent, la détection erronée d'un signal gyroscopique peut être réduite. La présente invention peut s'appliquer à un module intercalaire en verre.
(JA) 本開示は、製造時の熱膨張による歪の発生を低減することができるようにするガラスインタポーザモジュール、撮像装置、および電子機器に関する。 ガラスインタポーザとCIS(CMOSイメージセンサ)との間に、光透過性部材を充填する。これにより、ガラスインタポーザの剛性を向上させることが可能となるので、CISの撓みを抑制すると共に、ガラスインタポーザに搭載されるジャイロセンサ等に与える歪の影響を低減することができるので、ジャイロ信号の誤検出を低減させることができる。本開示は、ガラスインタポーザモジュールに適用することができる。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108701696US20180366385