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1. (WO2017138341) HEAT DISSIPATING DEVICE AND METHOD FOR ASSEMBLING HEAT DISSIPATING DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/138341 International Application No.: PCT/JP2017/002163
Publication Date: 17.08.2017 International Filing Date: 23.01.2017
IPC:
H01L 23/40 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
東芝キヤリア株式会社 TOSHIBA CARRIER CORPORATION [JP/JP]; 神奈川県川崎市幸区堀川町72番地34 72-34, Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa 2128585, JP
Inventors:
高田 鉄平 TAKADA, Teppei; JP
Agent:
特許業務法人スズエ国際特許事務所 S & S INTERNATIONAL PPC; 東京都港区虎ノ門一丁目12番9号 スズエ・アンド・スズエビル SUZUYE & SUZUYE BLDG., 1-12-9, Toranomon, Minato-ku, Tokyo 1050001, JP
Priority Data:
2016-02490312.02.2016JP
Title (EN) HEAT DISSIPATING DEVICE AND METHOD FOR ASSEMBLING HEAT DISSIPATING DEVICE
(FR) DISPOSITIF DE DISSIPATION DE CHALEUR ET PROCÉDÉ D'ASSEMBLAGE D'UN DISPOSITIF DE DISSIPATION DE CHALEUR
(JA) 放熱装置および放熱装置の組み立て方法
Abstract:
(EN) A heat dissipating device is provided with: a plurality of heat generating components which are electrically connected to a substrate and which are arranged in a predetermined direction with respect to the substrate; a heat dissipating member including a heat-receiving surface to which the heat generating components are thermally connected; and a plurality of fixtures which are attached to the heat dissipating member and which press the heat generating components onto the heat-receiving surface of the heat dissipating member. The fixtures are shaped to be open in a direction intersecting the direction in which the heat generating components are arranged, and are attached to the heat dissipating member in a posture such that the fixtures are opened in mutually opposite opening directions.
(FR) L'invention concerne un dispositif de dissipation de chaleur comportant: une pluralité de composants générant de la chaleur qui sont reliés électriquement à un substrat et qui sont disposés dans une direction prédéterminée par rapport au substrat; un élément de dissipation de chaleur comprenant une surface recevant de la chaleur à laquelle les composants générant de la chaleur sont reliés thermiquement; et une pluralité d'accessoires qui sont fixés à l'élément de dissipation de chaleur et qui plaquent les composants générant de la chaleur sur la surface recevant de la chaleur de l'élément de dissipation de chaleur. Les accessoires sont mis en forme pour être ouverts dans une direction croisant la direction suivant laquelle sont disposés les composants générant de la chaleur, et sont fixés à l'élément de dissipation de chaleur dans une posture telle que les accessoires sont ouverts dans des directions d'ouverture mutuellement opposées.
(JA) 放熱装置は、基板に電気的に接続されるとともに、基板に対し予め決められた方向に並べられた複数の発熱部品と、発熱部品が熱的に接続される受熱面を有する放熱部材と、放熱部材に取り付けられ、発熱部品を放熱部材の受熱面に押し付ける複数の固定具と、を備えている。固定具は、発熱部品の配列方向と交差する方向に開放された形状を有するとともに、固定具の開放方向が互いに逆向きとなる姿勢で放熱部材に取り付けられている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)