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1. (WO2017138310) ADHESIVE SHEET
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/138310 International Application No.: PCT/JP2017/001419
Publication Date: 17.08.2017 International Filing Date: 17.01.2017
IPC:
C09J 7/02 (2006.01) ,C09J 11/06 (2006.01) ,C09J 133/04 (2006.01) ,C09J 201/00 (2006.01) ,H01L 21/301 (2006.01) ,H01L 21/683 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
02
on carriers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
04
Homopolymers or copolymers of esters
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
デンカ株式会社 DENKA COMPANY LIMITED [JP/JP]; 東京都中央区日本橋室町二丁目1番1号 1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 1038338, JP
Inventors:
九津見 正信 KUTSUMI, Masanobu; JP
林 泰則 HAYASHI, Yasunori; JP
田中 秀 TANAKA, Shigeru; JP
Agent:
SK特許業務法人 SK INTELLECTUAL PROPERTY LAW FIRM; 東京都渋谷区広尾3-12-40 広尾ビル4階 Hiroo-Building 4th Floor, 3-12-40, Hiroo, Shibuya-ku, Tokyo 1500012, JP
奥野 彰彦 OKUNO Akihiko; JP
伊藤 寛之 ITO Hiroyuki; JP
Priority Data:
2016-02382510.02.2016JP
Title (EN) ADHESIVE SHEET
(FR) FEUILLE ADHÉSIVE
(JA) 粘着シート
Abstract:
(EN) Provided is an adhesive sheet which is able to be suppressed in changes of the characteristics of a bonding film X due to migration of an additive in the bonding film X to an adhesive tape in the adhesive sheet. The present invention provides an adhesive sheet in which a bonding film X, an adhesive layer Y and a base film Z are sequentially arranged in the order of X, Y and Z, and which is characterized in that: the bonding film X contains a base resin and 0.05-20% by mass of a first additive (A) that is a functional component selected from among a photopolymerization initiator, a thermal polymerization initiator, a polymerization inhibitor, an antistatic agent, a crosslinking accelerator, an anti-aging agent and a softening agent and has a molecular weight of 500 or less; the adhesive layer Y contains 100 parts by mass of a (meth)acrylate ester copolymer (B), 0.5-10 parts by mass of a polyfunctional isocyanate curing agent (C) and a second additive (D) that is the same functional component as the first additive (A) in the bonding film X and has a molecular weight of 500 or less; and 0.1-20% by mass of the second additive (D) is contained in 100% by mass of the adhesive layer Y.
(FR) La présente invention concerne une feuille adhésive qui peut être supprimée en modifiant les caractéristiques d'un film de liaison X par migration d'un additif dans le film de liaison X jusqu'à une bande adhésive dans la feuille adhésive. La présente invention concerne une feuille adhésive dans laquelle sont disposés successivement un film de liaison X, une couche adhésive Y et un film de base Z dans l'ordre de X, Y et Z, et qui est caractérisée en ce que : le film de liaison X contient une résine de base et de 0,05 à 20 % en masse d'un premier additif (A) qui est un constituant fonctionnel choisi parmi un initiateur de photopolymérisation, un initiateur de polymérisation thermique, un inhibiteur de polymérisation, un agent antistatique, un accélérateur de réticulation, un agent anti-vieillissement et un agent de ramollissement et présente une masse moléculaire inférieure ou égale à 500 ; la couche adhésive Y contient 100 parties en masse d'un copolymère d'ester de (méth)acrylate (B), de 0,5 à 10 parties en masse d'un agent de durcissement isocyanate polyfonctionnel (C) et un second additif (D) qui est le même constituant fonctionnel que le premier additif (A) dans le film de liaison X et présente une masse moléculaire inférieure ou égale à 500 ; et de 0,1 à 20 % en masse du second additif (D) présent dans 100 % en masse de la couche adhésive Y.
(JA) 粘着シートにおいて、接着フィルムX中の添加剤が粘着テープに移行することによる接着フィルムXの特性変化を抑制することが可能な粘着シートを提供する。 本発明によれば、接着フィルムXと、粘着剤層Yと、基材フィルムZをX、Y、Zの順に配置した粘着シートであって、前記接着フィルムXが、基体樹脂と、光重合開始剤、熱重合開始剤、重合禁止剤、帯電防止剤、架橋促進剤、老化防止剤、及び軟化剤から選択される機能成分であり且つ分子量が500以下である第1添加剤(A)を0.05~20質量%含有し、前記粘着剤層Yが、(メタ)アクリル酸エステル共重合体(B)100質量部と、多官能イソシアネート硬化剤(C)0.5~10質量部と、前記接着フィルムX中の第1添加剤(A)と同一の機能成分であり且つ分子量が500以下である第2添加剤(D)を含有し、第2添加剤(D)は、前記粘着剤層Y100質量%中に0.1~20質量%であることを特徴とする粘着シートが提供される。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180114101