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1. (WO2017138185) SUBSTRATE TREATMENT APPARATUS, SUBSTRATE HOLDING TOOL, AND PLACING TOOL
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/138185 International Application No.: PCT/JP2016/078220
Publication Date: 17.08.2017 International Filing Date: 26.09.2016
IPC:
H01L 21/31 (2006.01) ,C23C 16/458 (2006.01) ,H01L 21/683 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31
to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
44
characterised by the method of coating
458
characterised by the method used for supporting substrates in the reaction chamber
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
Applicants:
株式会社KOKUSAI ELECTRIC KOKUSAI ELECTRIC CORPORATION [JP/JP]; 東京都千代田区神田鍛冶町三丁目4番地 3-4, Kandakaji-cho, Chiyoda-ku, TOKYO 1010045, JP
Inventors:
平野 敦士 HIRANO, Atsushi; JP
竹林 雄二 TAKEBAYASHI, Yuji; JP
加我 友紀直 KAGA, Yukinao; JP
境 正憲 SAKAI, Masanori; JP
島田 真一 SHIMADA, Masakazu; JP
Priority Data:
2016-02362510.02.2016JP
Title (EN) SUBSTRATE TREATMENT APPARATUS, SUBSTRATE HOLDING TOOL, AND PLACING TOOL
(FR) APPAREIL DE TRAITEMENT DE SUBSTRAT, OUTIL DE MAINTIEN DE SUBSTRAT, ET OUTIL DE PLACEMENT
(JA) 基板処理装置、基板保持具及び載置具
Abstract:
(EN) Provided is a configuration whereby influence of gas consumption due to a boat can be ignored. In the configuration, a substrate holding tool equipped with a supporting column, to which a placing section for placing a substrate is attached, and an auxiliary supporting column, to which the placing section is not attached, is provided such that the diameter of the auxiliary supporting column is smaller than that of the supporting column, and at the time of holding the substrate by the placing section, the supporting column and an end portion of the substrate are separated from each other by a predetermined length.
(FR) La présente invention porte sur une configuration dans laquelle l'influence de consommation de gaz due à un bateau peut être ignorée. Dans la configuration, un outil de maintien de substrat équipé d'une colonne de support, sur laquelle une section de placement pour placer un substrat est fixée, et une colonne de support auxiliaire, à laquelle la section de placement n'est pas fixée, est fourni de telle sorte que le diamètre de la colonne de support auxiliaire est inférieure à celle de la colonne de support, et au moment de maintenir le substrat par la section de placement, la colonne de support et une partie d'extrémité du substrat sont séparées l'une de l'autre selon une longueur prédéterminée.
(JA) ボートによるガス消費の影響を無視できる構成を提供する。基板を載置する載置部が取り付けられた支柱と載置部が取り付けられていない補助支柱を備えた基板保持具は、補助支柱の径が支柱の径より小さく設けられ、基板を載置部で保持する際、基板の端部と支柱の間が所定長さ離間するよう設けられている構成が提供される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180100632CN109075069