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1. (WO2017136669) DEBONDABLE ADHESIVES AND THE HIGH TEMPERATURE USE THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/136669 International Application No.: PCT/US2017/016422
Publication Date: 10.08.2017 International Filing Date: 03.02.2017
IPC:
C09J 123/04 (2006.01) ,C09J 133/10 (2006.01) ,C09J 133/24 (2006.01) ,C09J 179/04 (2006.01) ,C09J 5/00 (2006.01) ,C09J 4/06 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
123
Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
02
not modified by chemical after-treatment
04
Homopolymers or copolymers of ethene
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
04
Homopolymers or copolymers of esters
06
of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
10
Homopolymers or copolymers of methacrylic acid esters
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
133
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
24
Homopolymers or copolymers of amides or imides
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
179
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/-C09J177/263
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5
Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
06
in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/-C09J187/142
Applicants:
HENKEL IP & HOLDING GMBH [DE/DE]; Henkelstrasse 67 40589 Duesseldorf, DE
LITKE, Alan E. [US/US]; US (US)
Inventors:
LITKE, Alan E.; US
ISSARI, Bahram; US
SRIDHAR, Laxmisha; US
Agent:
BAUMAN, Steven C.; US
CUMMINGS, James J.; US
CAMERON, Mary K.; US
PIOTROWSKI, James E.; US
LEHMANN, Sunhee; US
Priority Data:
62/291,18104.02.2016RU
Title (EN) DEBONDABLE ADHESIVES AND THE HIGH TEMPERATURE USE THEREOF
(FR) ADHÉSIFS DÉCOLLABLES ET UTILISATION À HAUTE TEMPÉRATURE CORRESPONDANTE
Abstract:
(EN) Provided herein are debondable adhesive compositions comprising (A) one or more bis-maleimide (BMI), nadimide or itaconimide oligomer(s), (B) at least one ethylenically unsaturated co-monomer (e.g. co-monomers selected from the group consisting of acrylates, methacrylates, vinyl ethers, vinyl esters, styrenic compounds, allyl compounds, polybutadienes, cinnamates, crotonates, and mixtures of any two or more thereof), and (C) a photoinitiator. In another embodiment, the present invention is directed to an assembly of a substrate and a carrier for the substrate in which the debondable adhesive composition temporarily bonds the substrates, and a method for fabricating the assembly. The debondable adhesive compositions maintain their adhesion at temperatures of 300°C or greater, are easily and cleanly debondable at ambient conditions, permit temporary bonding at high processing conditions, and do not compromise handling or performance of the substrates.
(FR) L'invention concerne des compositions adhésives décollables comprenant : (A) un ou plusieurs oligomères de bis-maléimide (BMI), de nadimide ou d'itaconimide, (B) au moins un comonomère éthyléniquement insaturé (par exemple, des comonomères choisis dans le groupe constitué par les acrylates, les méthacrylates, les vinyléthers, les esters de vinyle, les composés styréniques, des composés d'allyle, les polybutadiènes, les cinnamates, les crotonates et les mélanges de deux ou plus de ceux-ci) et (C) un photo-initiateur. Dans un autre mode de réalisation, la présente invention concerne un assemblage d'un substrat et d'un support pour le substrat, dans lequel la composition adhésive décollable lie temporairement les substrats, et un procédé pour fabriquer ledit assemblage. Les compositions adhésives décollables conservent leur adhérence à des températures de 300°C ou plus, sont facilement et proprement décollables à température ambiante, permettent une liaison temporaire à des conditions de traitement élevées et ne compromettent pas la manipulation ou les performances des substrats.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
CN108699411KR1020180123009EP3411447