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1. (WO2017136465) FIELD CURVATURE CORRECTION FOR MULTI-BEAM INSPECTION SYSTEMS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/136465 International Application No.: PCT/US2017/016082
Publication Date: 10.08.2017 International Filing Date: 01.02.2017
IPC:
H01L 21/66 (2006.01) ,H01L 21/67 (2006.01) ,H01L 21/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
Applicants:
KLA-TENCOR CORPORATION [US/US]; Legal Department One Technology Drive Milpitas, California 95035, US
Inventors:
BRODIE, Alan D.; US
KNIPPELMEYER, Rainer; US
SEARS, Christopher; US
ROUSE, John; GB
CHEN, Grace H.; US
Agent:
MCANDREWS, Kevin; US
MORRIS, Elizabeth M. N; US
Priority Data:
15/173,14403.06.2016US
62/291,12004.02.2016US
Title (EN) FIELD CURVATURE CORRECTION FOR MULTI-BEAM INSPECTION SYSTEMS
(FR) CORRECTION DE COURBURE DE CHAMP DE SYSTÈMES D'INSPECTION MULTIFAISCEAUX
Abstract:
(EN) Multi-beam e-beam columns and inspection systems that use such multi-beam e-beam columns are disclosed. A multi-beam e-beam column configured in accordance with the present disclosure may include an electron source and a multi-lens array configured to produce a plurality of beamlets utilizing electrons provided by the electron source. The multi-lens array may be further configured to shift a focus of at least one particular beamlet of the plurality of beamlets such that the focus of the at least one particular beamlet is different from a focus of at least one other beamlet of the plurality of beamlets.
(FR) L'invention concerne des colonnes à faisceaux électroniques multifaisceaux et des systèmes d'inspection qui font appel auxdites colonnes à faisceaux électroniques multifaisceaux. Une colonne à faisceaux électroniques multifaisceaux conçue selon la présente invention peut comprendre une source d'électrons et un réseau multilentilles conçu pour produire une pluralité de mini-faisceaux au moyen d'électrons fournis par la source d'électrons. Le réseau multilentilles peut en outre être conçu pour décaler un point focal d'au moins un mini-faisceau particulier de la pluralité de mini-faisceaux de sorte que le point focal dudit mini-faisceau particulier soit différent d'un point focal d'au moins un autre mini-faisceau de la pluralité de mini-faisceaux.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
SG11201805471QCN108604562KR1020180101724EP3411901IL260461