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1. (WO2017136282) INSTRUMENTED SUBSTRATE APPARATUS FOR ACQUIRING MEASUREMENT PARAMETERS IN HIGH TEMPERATURE PROCESS APPLICATIONS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/136282 International Application No.: PCT/US2017/015648
Publication Date: 10.08.2017 International Filing Date: 30.01.2017
IPC:
H01L 21/66 (2006.01) ,H01L 21/67 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Applicants:
KLA-TENCOR CORPORATION [US/US]; Legal Department One Technology Drive Milpitas, California 95035, US
Inventors:
SUN, Mei; US
VISHAL, Vaibhaw; US
Agent:
MCANDREWS, Kevin; US
MORRIS, Elizabeth M. N; US
Priority Data:
15/277,75327.09.2016US
62/290,15302.02.2016US
Title (EN) INSTRUMENTED SUBSTRATE APPARATUS FOR ACQUIRING MEASUREMENT PARAMETERS IN HIGH TEMPERATURE PROCESS APPLICATIONS
(FR) APPAREIL DE SUBSTRAT INSTRUMENTÉ POUR ACQUISITION DE PARAMÈTRES DE MESURE DANS DES APPLICATIONS DE TRAITEMENT À HAUTE TEMPÉRATURE
Abstract:
(EN) An apparatus includes a substrate, a nested enclosure assembly including an outer enclosure and an inner enclosure, wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses at least the electronic assembly. An insulating medium is disposed within a cavity between the outer surface of the inner enclosure and the inner surface of the outer enclosure and the system includes a sensor assembly communicatively coupled to the electronic assembly. The sensor assembly includes one or more sensors that are configured to acquire one or more measurement parameters at one or more locations of the substrate. The electronic assembly is configured to receive the one or more measurement parameters from the one or more sensors.
(FR) L'invention concerne un appareil qui comprend un substrat, un ensemble d'enceintes emboîtées comprenant une enceinte extérieure et une enceinte intérieure, l'enceinte extérieure entourant l'enceinte intérieure et l'enceinte intérieure entourant au moins un ensemble électronique. Un milieu isolant est disposé à l'intérieur d'une cavité présente entre la surface extérieure de l'enceinte intérieure et la surface intérieure de l'enveloppe extérieure, et le système comprend un ensemble de capteurs couplé pour communiquer avec l'ensemble électronique. L'ensemble de capteurs comprend un ou plusieurs capteurs configurés pour acquérir un ou plusieurs paramètres de mesure à un ou plusieurs emplacements du substrat. L'ensemble électronique est configuré pour recevoir le ou les paramètres de mesure en provenance du ou des capteurs.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
SG11201806533SCN108604559KR1020180101616