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1. (WO2017136061) OPEN-PASSIVATION BALL GRID ARRAY PADS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/136061 International Application No.: PCT/US2016/068033
Publication Date: 10.08.2017 International Filing Date: 21.12.2016
Chapter 2 Demand Filed: 31.10.2017
IPC:
H05K 3/34 (2006.01) ,H01L 23/31 (2006.01) ,H05K 3/00 (2006.01) ,H05K 1/11 (2006.01) ,H05K 1/03 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
34
by soldering
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
QUALCOMM INCORPORATED [US/US]; ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714, US
Inventors:
KIM, Daeik Daniel; US
VELEZ, Mario Francisco; US
YUN, Changhan Hobie; US
ZUO, Chengjie; US
BERDY, David Francis; US
KIM, Jonghae; US
MUDAKATTE, Niranjan Sunil; US
Agent:
LENKIN, Alan M.; US
LUTZ, Joseph; US
CROSBY, Cornell D.; US
PARTOW-NAVID, Puya; US
BARZILAY, Ilan N.; US
FASHU-KANU, Alvin V.; US
Priority Data:
15/077,86922.03.2016US
62/289,63601.02.2016US
Title (EN) OPEN-PASSIVATION BALL GRID ARRAY PADS
(FR) PLAGES DE CONNEXION DE BOÎTIERS MATRICIELS À BILLES À PASSIVATION OUVERTE
Abstract:
(EN) A conductive bump assembly may include a passive substrate. The conductive bump assembly may also include a conductive bump pad supported by the passive substrate and surrounded by a first passivation layer opening. The conductive bump assembly may further include a second passivation layer opening on the passive substrate. The second passivation layer opening may be merged with the first passivation layer opening surrounding the conductive bump pad proximate an edge of the passive substrate. The conductive bump assembly may also include a conductive bump on the conductive bump pad.
(FR) Un ensemble de bosse conductrice peut comprendre un substrat passif. L'ensemble de bosse conductrice peut également comprendre une plage de connexion de bosse conductrice supportée par le substrat passif et entourée par une première ouverture de la couche de passivation. La bosse conductrice peut en outre comprendre une deuxième ouverture de la couche de passivation, située sur le substrat passif. La deuxième ouverture de la couche de passivation peut fusionner avec la première ouverture de la couche de passivation entourant la plage de connexion de bosse conductrice, à proximité d'un bord du substrat passif. L'ensemble de bosse conductrice peut également comprendre un bosse conductrice, située sur la plage de connexion de bosse conductrice.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
CA3010589IN201847024577CN108605414KR1020180108625EP3412122BR112018015581