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1. (WO2017135257) ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD, AND METHOD FOR MANUFACTURING PACKAGE COMPONENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/135257 International Application No.: PCT/JP2017/003439
Publication Date: 10.08.2017 International Filing Date: 31.01.2017
IPC:
H01L 21/677 (2006.01) ,H01L 23/12 (2006.01) ,H05K 13/04 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04
Mounting of components
Applicants:
芝浦メカトロニクス株式会社 SHIBAURA MECHATRONICS CORPORATION [JP/JP]; 神奈川県横浜市栄区笠間二丁目5番1号 5-1, Kasama 2-chome, Sakae-ku, Yokohama-shi, Kanagawa 2478610, JP
Inventors:
橋本 正規 HASHIMOTO Masaki; JP
井田 琢也 IDA Takuya; JP
Agent:
特許業務法人サクラ国際特許事務所 SAKURA PATENT OFFICE, P.C.; 東京都千代田区神田司町二丁目8番1号 PMO神田司町 PMO Kanda Tsukasa-machi, 8-1, Kanda Tsukasa-machi 2-chome, Chiyoda-ku, Tokyo 1010048, JP
Priority Data:
2016-01702501.02.2016JP
Title (EN) ELECTRONIC COMPONENT MOUNTING DEVICE AND MOUNTING METHOD, AND METHOD FOR MANUFACTURING PACKAGE COMPONENT
(FR) DISPOSITIF ET PROCÉDÉ DE MONTAGE DE COMPOSANTS ÉLECTRONIQUES, ET PROCÉDÉ DE FABRICATION DE COMPOSANT SOUS BOÎTIER
(JA) 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法
Abstract:
(EN) This mounting device (1) is provided with: a stage unit (20) for moving a stage (21) on which a support substrate (W) is placed so that a plurality of mounting regions of the support substrate (W) are positioned in sequence in fixed mounting positions; a mounting unit (50) for individually moving, to a mounting position, a first and second mounting head for respectively holding and mounting an electronic component in a mounting region; a first recognition unit (22) for recognizing the overall position of the support substrate (W) on the stage (21); and a second recognition unit for recognizing the position of the electronic component held in the first or second mounting head, the movement of the stage (21) and the first and second mounting heads being controlled on the basis of the correction data for the moving position error of the stage (21) caused by the movement mechanism, the support substrate (W) position data, and the electronic component position data.
(FR) L'invention concerne un dispositif de montage (1) qui comprend : une unité de platine (20) pour déplacer une platine (21) sur laquelle un substrat de support (W) est placé, de manière à positionner séquentiellement une pluralité de régions de montage du substrat de support (W) dans des positions de montage fixes ; une unité de montage (50) pour déplacer individuellement, jusqu'à une position de montage, de première et seconde têtes de montage servant respectivement à tenir et à monter un composant électronique dans une région de montage ; une première unité de reconnaissance (22) pour reconnaître la position globale du substrat de support (W) sur la platine (21) ; et une seconde unité de reconnaissance pour reconnaître la position du composant électronique tenu dans la première ou seconde tête de montage, les mouvements de la platine (21) et des première et seconde têtes de montage étant commandés sur la base de données de correction de l'erreur de position de déplacement de la platine (21) causée par le mécanisme de déplacement, des données de position du substrat de support (W) et des données de position du composant électronique.
(JA) 実施形態の実装装置1は、支持基板Wの複数の実装領域が一定の実装位置に順に位置付けられるように、支持基板Wが載置されたステージ21を移動させるステージ部20と、それぞれ電子部品を保持して実装領域に実装する第1および第2の実装ヘッドを実装位置に個別に移動させる実装部50と、ステージ21上の支持基板Wの全体位置を認識する第1の認識部22と、第1または第2の実装ヘッドに保持された電子部品の位置を認識する第2の認識部とを具備し、ステージ21と第1および第2の実装ヘッドの移動は、移動機構によるステージ21の移動位置誤差の補正データと支持基板Wの位置データと電子部品の位置データとに基づいて制御される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180081772