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1. (WO2017135142) HEAT-DISSIPATING SUBSTRATE, DEVICE, AND METHOD FOR MANUFACTURING HEAT-DISSIPATING SUBSTRATE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/135142 International Application No.: PCT/JP2017/002684
Publication Date: 10.08.2017 International Filing Date: 26.01.2017
IPC:
H01L 23/373 (2006.01) ,H05K 7/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
株式会社神戸製鋼所 KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) [JP/JP]; 兵庫県神戸市中央区脇浜海岸通二丁目2番4号 2-4, Wakinohama-Kaigandori 2-chome, Chuo-ku, Kobe-shi, Hyogo 6518585, JP
Inventors:
水野 雅夫 MIZUNO Masao; --
志田 陽子 SHIDA Yoko; --
Agent:
特許業務法人栄光特許事務所 EIKOH PATENT FIRM, P.C.; 東京都港区西新橋一丁目7番13号 虎ノ門イーストビルディング10階 Toranomon East Bldg. 10F, 7-13, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 1050003, JP
Priority Data:
2016-02074105.02.2016JP
Title (EN) HEAT-DISSIPATING SUBSTRATE, DEVICE, AND METHOD FOR MANUFACTURING HEAT-DISSIPATING SUBSTRATE
(FR) SUBSTRAT DE DISSIPATION THERMIQUE, DISPOSITIF, ET PROCÉDÉ DE FABRICATION D'UN SUBSTRAT DE DISSIPATION THERMIQUE
(JA) 放熱基板、デバイス及び放熱基板の製造方法
Abstract:
(EN) A heat-dissipating substrate according to the present invention is provided with: a base material the principal constituent of which is a metal; and a heat conductive layer laminated on one surface of this base material. The heat conductive layer has an inorganic layer containing: a heat conductive filler; a binder the principal constituent of which is phosphate glass; and a silica-based compound. The total proportion of the heat conductive filler and the binder, as well as the proportion of the heat conductive filler, in the inorganic layer are within respective specific ranges.
(FR) Le substrat de dissipation thermique de l'invention comprend: un matériau de base dont le constituant principal est un métal; et une couche thermoconductrice stratifiée sur une surface dudit matériau de base. La couche thermoconductrice présente une couche inorganique contenant: une charge thermoconductrice; un liant dont le constituant principal est du verre de phosphate; et un composé à base de silice. La proportion totale de la charge thermoconductrice et du liant, ainsi que la proportion de la charge thermoconductrice dans la couche inorganique se situent dans des plages spécifiques respectives.
(JA) 本発明の放熱基板は、金属を主成分とする基材と、この基材の一方の面に積層された熱伝導層とを備え、熱伝導層は、熱伝導性フィラーと、リン酸塩ガラスを主成分とするバインダーと、シリカ系化合物とを含有する無機物層とを有する。無機物層における熱伝導性フィラーとバインダーとの合計割合、並びに熱伝導性フィラーの割合が、それぞれ特定範囲である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)