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1. (WO2017135112) THERMOSETTING RESIN COMPOSITION FOR SEALING, AND SHEET FOR SEALING
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/135112 International Application No.: PCT/JP2017/002428
Publication Date: 10.08.2017 International Filing Date: 25.01.2017
IPC:
C08L 63/00 (2006.01) ,C08K 3/00 (2006.01) ,C08K 3/26 (2006.01) ,C08K 3/34 (2006.01) ,C08L 101/00 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/04 (2006.01) ,H01L 31/048 (2014.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
24
Acids; Salts thereof
26
Carbonates; Bicarbonates
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
04
Sealing arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
04
adapted as conversion devices
042
including a panel or array of photoelectric cells, e.g. solar cells
048
encapsulated or with housing
Applicants:
味の素株式会社 AJINOMOTO CO., INC. [JP/JP]; 東京都中央区京橋一丁目15番1号 15-1, Kyobashi 1-chome, Chuo-ku, Tokyo 1048315, JP
Inventors:
久保 有希 KUBO, Yuki; JP
Agent:
高島 一 TAKASHIMA, Hajime; JP
Priority Data:
2016-01702801.02.2016JP
Title (EN) THERMOSETTING RESIN COMPOSITION FOR SEALING, AND SHEET FOR SEALING
(FR) COMPOSITION DE RÉSINE THERMODURCISSABLE POUR LE SCELLEMENT, ET FEUILLE DE SCELLEMENT
(JA) 封止用の熱硬化性樹脂組成物および封止用シート
Abstract:
(EN) The present invention provides a thermosetting resin composition for sealing, which contains (A) a thermosetting resin, (B) a curing agent and (C) semi-calcined hydrotalcite as an inorganic filler, wherein when the thermogravimetric loss rate prior to moisture absorption, as measured by thermogravimetric analysis, at 280ºC of a cured product of the thermosetting resin composition is denoted by X1 (%), the thermogravimetric loss rate prior to moisture absorption of the cured product at 380ºC is denoted by Y1 (%), the thermogravimetric loss rate following moisture absorption, as measured by thermogravimetric analysis, at 280ºC of the cured product of the thermosetting resin composition is denoted by X2 (%) and the thermogravimetric loss rate following moisture absorption of the cured product at 380ºC is denoted by Y2 (%), the relationships 2% ≤ X2-X1 and Y2-Y1 ≤ 10% are satisfied and the overall content of inorganic filler, including semi-calcined hydrotalcite, is 20-60 mass% relative to the overall quantity of non-volatile components in the thermosetting resin composition.
(FR) La présente invention concerne une composition de résine thermodurcissable pour scellement, qui contient (A) une résine thermodurcissable, (B) un agent de durcissement et (C) une hydrotalcite semi-calcinée en tant que charge inorganique, et lorsque le taux de perte thermogravimétrique préalable à l'absorption d'humidité, mesuré par analyse thermogravimétrique, à 280 °C d'un produit durci de la composition de résine thermodurcissable est désigné par X1 (%), lorsque le taux de perte thermogravimétrique préalable à l'absorption d'humidité du produit durci à 380 °C est désigné par Y1 (%), le taux de perte thermogravimétrique après absorption de l'humidité, mesuré par analyse thermogravimétrique, à 280 °C du produit durci de la composition de résine thermodurcissable est désigné par X2 (%) et lorsque le taux de perte thermogravimétrique après absorption d'humidité du produit durci à 380 °C est désigné par Y2 (%), alors les relations 2% ≤ X2-X1 et Y2-Y1 ≤ 10% sont satisfaites et la teneur globale en charge inorganique, comprenant l'hydrotalcite semi-calcinée, est de 20 à 60 % en masse par rapport à la quantité totale de composants non volatils dans la composition de résine thermodurcissable.
(JA) 本発明は、(A)熱硬化性樹脂、(B)硬化剤、および無機充填剤として(C)半焼成ハイドロタルサイトを含む封止用の熱硬化性樹脂組成物であって、吸湿前の該熱硬化性樹脂組成物の硬化物の熱重量分析による280℃における熱重量減少率をX(%)、380℃における熱重量減少率をY(%)とし、吸湿後の該熱硬化性樹脂組成物の硬化物の熱重量分析による280℃における熱重量減少率をX(%)、380℃における熱重量減少率をY(%)としたとき、2%≦X-X、且つY-Y≦10%の関係を満たし、半焼成ハイドロタルサイトを含む無機充填剤全体の含有量が、熱硬化性樹脂組成物の不揮発分全体当たり20~60質量%である熱硬化性樹脂組成物を提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108495894KR1020180104319