Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017135071) POWER CONVERSION DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/135071 International Application No.: PCT/JP2017/001909
Publication Date: 10.08.2017 International Filing Date: 20.01.2017
IPC:
H02M 7/48 (2007.01) ,H05K 1/14 (2006.01) ,H05K 7/14 (2006.01)
H ELECTRICITY
02
GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
M
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
7
Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
42
Conversion of dc power input into ac power output without possibility of reversal
44
by static converters
48
using discharge tubes with control electrode or semiconductor devices with control electrode
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
14
Mounting supporting structure in casing or on frame or rack
Applicants:
株式会社デンソー DENSO CORPORATION [JP/JP]; 愛知県刈谷市昭和町1丁目1番地 1-1, Showa-cho, Kariya-city, Aichi 4488661, JP
Inventors:
木暮 晋太郎 KOGURE Shintaro; JP
Agent:
特許業務法人あいち国際特許事務所 AICHI, TAKAHASHI, IWAKURA & ASSOCIATES; 愛知県名古屋市中村区名駅3丁目26番19号 名駅永田ビル Meieki Nagata Building, 26-19, Meieki 3-chome, Nakamura-ku, Nagoya-shi, Aichi 4500002, JP
Priority Data:
2016-02106105.02.2016JP
Title (EN) POWER CONVERSION DEVICE
(FR) DISPOSITIF DE CONVERSION DE PUISSANCE
(JA) 電力変換装置
Abstract:
(EN) A power conversion device (1) is provided with: a semiconductor module (30); a first electronic circuit substrate (10) and a second electronic circuit substrate (20); and an accommodation body (2) for accommodating both the first electronic circuit substrate (10) and the second electronic circuit substrate (20). The accommodation body (2) comprises a first fixing section (5) to which the first electronic circuit substrate (10) is fixed and a second fixing section (9) to which the second electronic circuit substrate (20) is fixed. The accommodation body (2) is configured so that the second electronic circuit substrate (20) is not between the first fixing section (5) of the accommodation body (2) and the first electronic circuit substrate (10) in the substrate thickness direction (Z) and the first electronic circuit substrate (10) is not between the second fixing section (9) of the accommodation body (2) and the second electronic circuit substrate (20) in the substrate thickness direction (Z).
(FR) La présente invention concerne un dispositif de conversion de puissance (1) qui comporte : un module à semi-conducteur (30) ; un premier substrat de circuit électronique (10) et un second substrat de circuit électronique (20) ; et un corps de logement (2) pour recevoir à la fois le premier substrat de circuit électronique (10) et le second substrat de circuit électronique (20). Le corps de logement (2) comprend une première section de fixation (5) sur laquelle est fixé le premier substrat de circuit électronique (10) et une seconde section de fixation (9) sur laquelle est fixé le second substrat de circuit électronique (20). Le corps de logement (2) est configuré de sorte que le second substrat de circuit électronique (20) ne se situe pas entre la première section de fixation (5) du corps de logement (2) et le premier substrat de circuit électronique (10) dans la direction de l'épaisseur du substrat (Z) et le premier substrat de circuit électronique (10) ne se situe pas entre la seconde section de fixation (9) du corps de logement (2) et le second substrat de circuit électronique (20) dans la direction de l'épaisseur du substrat (Z).
(JA) 電力変換装置(1)は、半導体モジュール(30)と、第1電子回路基板(10)及び第2電子回路基板(20)と、第1電子回路基板(10)及び第2電子回路基板(20)を共に収容する収容体(2)と、を備え、収容体(2)は、第1電子回路基板(10)が固定される第1固定部(5)と、第2電子回路基板(20)が固定される第2固定部(9)と、を有し、基板厚み方向(Z)について収容体(2)の第1固定部(5)と第1電子回路基板(10)との間に第2電子回路基板(20)が介在しないように、且つ基板厚み方向(Z)について収容体(2)の第2固定部(9)と第2電子回路基板(20)との間に第1電子回路基板(10)が介在しないように構成されている。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108702102US20190075673