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1. (WO2017134999) Cu-Ga ALLOY SPUTTERING TARGET MANUFACTURING METHOD, AND Cu-Ga ALLOY SPUTTERING TARGET
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/134999 International Application No.: PCT/JP2017/000768
Publication Date: 10.08.2017 International Filing Date: 12.01.2017
IPC:
C23C 14/34 (2006.01) ,B22F 3/02 (2006.01) ,B22F 3/10 (2006.01) ,B22F 5/10 (2006.01) ,C22C 1/04 (2006.01) ,C22C 9/00 (2006.01) ,C22C 28/00 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
3
Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor
02
Compacting only
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
3
Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor
10
Sintering only
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
5
Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
10
of articles with cavities or holes, not otherwise provided for in the preceding subgroups
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
1
Making non-ferrous alloys
04
by powder metallurgy
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
28
Alloys based on a metal not provided for in groups C22C5/-C22C27/103
Applicants:
三菱マテリアル株式会社 MITSUBISHI MATERIALS CORPORATION [JP/JP]; 東京都千代田区大手町一丁目3番2号 3-2, Otemachi 1-chome, Chiyoda-ku, Tokyo 1008117, JP
Inventors:
吉田 勇気 YOSHIDA Yuki; JP
植田 稔晃 UEDA Toshiaki; JP
森 曉 MORI Satoru; JP
Agent:
志賀 正武 SHIGA Masatake; JP
寺本 光生 TERAMOTO Mitsuo; JP
松沼 泰史 MATSUNUMA Yasushi; JP
細川 文広 HOSOKAWA Fumihiro; JP
大浪 一徳 ONAMI Kazunori; JP
Priority Data:
2016-01928203.02.2016JP
2016-25082726.12.2016JP
Title (EN) Cu-Ga ALLOY SPUTTERING TARGET MANUFACTURING METHOD, AND Cu-Ga ALLOY SPUTTERING TARGET
(FR) PROCÉDÉ DE FABRICATION DE CIBLE DE PULVÉRISATION CATHODIQUE EN ALLIAGE Cu-Ga, ET CIBLE DE PULVÉRISATION CATHODIQUE EN ALLIAGE Cu-Ga
(JA) Cu-Ga合金スパッタリングターゲットの製造方法、及び、Cu-Ga合金スパッタリングターゲット
Abstract:
(EN) This manufacturing method of a Cu-Ga alloy sputtering target (10), formed from a Cu-Ga alloy and having a hollow portion, involves a calcining step (S02) in which a raw material powder containing at least a CuGA alloy powder is filled into a mold having a core (32) and is heated in a reducing atmosphere to form a calcined body (13), and a main sintering step (S03) in which the core (32) is removed from the calcined body (13) and said calcined body (13) is heated in a reducing atmosphere to form a sintered body, wherein, as the core (32) in the calcining step (S02), a core is used that is configured from a material having a linear thermal expansion coefficient greater than that of the Cu-Ga alloy configuring the Cu-Ga alloy sputtering target (10), and, by being maintained at a temperature between 100°C and 600°C for between 10 minutes and 10 hours, the calcined body (13) is formed.
(FR) L'invention concerne un procédé de fabrication d'une cible (10) de pulvérisation cathodique en alliage Cu-Ga, formée à partir d'un alliage Cu-Ga et comportant une partie creuse. Ledit procédé comprend une étape de calcination (S02), dans laquelle une poudre de matière première contenant au moins une poudre d'alliage CuGA est introduite dans un moule comportant un noyau (32), et est chauffée sous atmosphère réductrice pour former un corps calciné (13); et une étape de frittage (S03) principal, dans laquelle le noyau (32) est retiré du corps calciné (13) et ledit corps calciné (13) est chauffé sous atmosphère réductrice pour former un corps fritté; on utilise en tant que noyau (32), à l'étape de calcination (S02), un noyau constitué d'un matériau dont le coefficient de dilatation thermique linéaire est supérieur à celui de l'alliage Cu-Ga constituant la cible (10) de pulvérisation cathodique en alliage Cu-Ga, et le corps calciné (13) est formé par maintien à une température comprise entre 100 °C et 600 °C pendant une durée comprise entre 10 minutes et 10 heures.
(JA) Cu-Ga合金からなり、中空部を有するCu-Ga合金スパッタリングターゲット(10)の製造方法であって、少なくともCuGa合金粉を含む原料粉を、中子(32)を有する成形型に充填し、還元雰囲気で加熱して仮焼体(13)を形成する仮焼工程(S02)と、前記仮焼体(13)から前記中子(32)を抜き取り、還元雰囲気中で前記仮焼体(13)を加熱して焼結体を形成する本焼結工程(S03)と、を有し、前記仮焼工程(S02)においては、前記中子(32)として、前記Cu-Ga合金スパッタリングターゲット(10)を構成するCu-Ga合金よりも線熱膨張係数が大きい材質で構成されたものを使用し、100℃以上600℃以下の温度で10分以上10時間以下保持することにより、前記仮焼体(13)を形成する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108603280EP3412795US20190040524