Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017134989) IMPRINTING DEVICE, AND ARTICLE PRODUCTION METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/134989 International Application No.: PCT/JP2017/000578
Publication Date: 10.08.2017 International Filing Date: 11.01.2017
IPC:
H01L 21/027 (2006.01) ,B29C 59/04 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
59
Surface shaping, e.g. embossing; Apparatus therefor
02
by mechanical means, e.g. pressing
04
using rollers or endless belts
Applicants:
キヤノン株式会社 CANON KABUSHIKI KAISHA [JP/JP]; 東京都大田区下丸子3丁目30番2号 30-2, Shimomaruko 3-chome, Ohta-ku, Tokyo 1468501, JP
Inventors:
坂本 英治 SAKAMOTO Eiji; JP
Agent:
高岡 亮一 TAKAOKA Ryoichi; JP
小田 直 ODA Nao; JP
Priority Data:
2016-01874603.02.2016JP
2016-24068912.12.2016JP
Title (EN) IMPRINTING DEVICE, AND ARTICLE PRODUCTION METHOD
(FR) DISPOSITIF À ESTAMPER ET PROCÉDÉ DE PRODUCTION D’ARTICLES
(JA) インプリント装置および物品の製造方法
Abstract:
(EN) This imprinting device 1, which uses a die to form a pattern on a substrate 5, is provided with: a substrate stage 6 which holds the substrate 5 and can be moved; a perforated plate 10 which is a plate member provided with holes, and which is provided to the outer circumference of an area where the substrate 5 is held on the substrate stage 6; and a control unit which controls the suction of gas from a space above the substrate stage 6 via the holes, and the emission of gas into the space above the substrate stage 6, in order to inhibit entry of foreign matter 90 in the vicinity of the upper surface of the substrate stage 6 into an imprinting space.
(FR) Le dispositif à estamper 1 de l’invention, qui utilise un poinçon pour former un motif sur un substrat 5, comprend : un étage de substrat 6 qui maintient le substrat 5 et qui peut être déplacé ; un plateau ajouré 10 qui est un élément en plaque doté de trous, et qui est disposé sur la circonférence extérieure d’une zone dans laquelle le substrat 5 est maintenu sur l’étage de substrat 6 ; et une unité de commande qui commande l’aspiration de gaz depuis un espace situé au-dessus de l’étage de substrat 6, via les trous, ainsi que l’émission de gaz dans l’espace situé au-dessus de l’étage de substrat 6, afin d’empêcher la pénétration de corps étrangers 90 au voisinage de la surface supérieure de l’étage de substrat 6, dans un espace d’estampage.
(JA) 型を用いて基板5にパターンを形成するインプリント装置1は、基板5を保持して移動可能な基板ステージ6と、基板ステージ6上の基板5を保持する領域の外周部に配置され、孔を有する板部材である多孔板10と、基板ステージ6の上面近傍の異物90がインプリント空間に侵入するのを防止するために孔を介して基板ステージ6上の空間の気体を吸引または基板ステージ6上の空間に対する気体の放出を制御する制御部と、を有する。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020180098626