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1. (WO2017134974) BONDING MATERIAL, AND BONDING METHOD AND BONDING STRUCTURE USING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/134974 International Application No.: PCT/JP2017/000071
Publication Date: 10.08.2017 International Filing Date: 05.01.2017
IPC:
B23K 35/14 (2006.01) ,B23K 1/00 (2006.01) ,B23K 1/19 (2006.01) ,B23K 35/26 (2006.01) ,B23K 35/30 (2006.01) ,C22C 9/06 (2006.01) ,C22C 13/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
02
characterised by mechanical features, e.g. shape
12
not specially designed for use as electrodes
14
for soldering
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1
Soldering, e.g. brazing, or unsoldering
19
taking account of the properties of the materials to be soldered
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
24
Selection of soldering or welding materials proper
26
with the principal constituent melting at less than 400C
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
24
Selection of soldering or welding materials proper
30
with the principal constituent melting at less than 1550°C
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
06
with nickel or cobalt as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
13
Alloys based on tin
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
野口 真純 NOGUCHI, Masumi; JP
Agent:
鮫島 睦 SAMEJIMA, Mutsumi; JP
岡部 博史 OKABE, Hiroshi; JP
中谷 剣一 NAKATANI, Kenichi; JP
Priority Data:
2016-01721101.02.2016JP
Title (EN) BONDING MATERIAL, AND BONDING METHOD AND BONDING STRUCTURE USING SAME
(FR) MATÉRIAU DE LIAISON, PROCÉDÉ DE LIAISON METTANT EN ŒUVRE CELUI-CI, ET STRUCTURE DE LIAISON
(JA) 接合材、それを用いた接合方法及び接合構造
Abstract:
(EN) A bonding material which improves impact resistance while improving heat resistance and can bond together objects to be bonded, and a bonding method and bonding structure using said bonding material are provided. This bonding material (10), for bonding two objects to be bonded (14a, 14b), has a first layer (11), in which the primary component is Sn, and a second layer (12), in which the primary component is a metal having a melting point higher than that of Sn, wherein the first layer (11) and the second layer (12) are stacked and the amount of Sn in the first layer (11) is greater than the stoichiometric amount of Sn that forms an intermetallic compound (15) between the Sn and the metal.
(FR) L’invention fournit un matériau de liaison, un procédé de liaison mettant en œuvre celui-ci et une structure de liaison qui présentent à la fois une amélioration en termes de résistance à la chaleur et de résistance aux chocs, et qui permettent de lier des objets de liaison. Le matériau de liaison (10) de l’invention lie deux objets de liaison (14a, 14b), et est équipé : d’une première couche (11) ayant un Sn pour composant principal, et une seconde couche (12) ayant un métal dont le point de fusion est supérieur au Sn pour composant principal. La première et la seconde couche (11, 12) sont stratifiées. La quantité de Sn dans la première couche (11) est supérieure à une quantité stœchiométrique de Sn formant un composé intermétallique (15) entre le Sn et le métal.
(JA) 耐熱性を向上させつつ、且つ耐衝撃性を向上させて接合対象物を接合することができる接合材、それを用いた接合方法及び接合構造を提供する。本発明の接合材は、2つの接合対象物(14a、14b)を接合する接合材(10)であって、Snを主成分とする第1層(11)と、Snより高い融点を有する金属を主成分とする第2層(12)と、を備え、第1層(11)と第2層(12)とは積層され、第1層(11)におけるSnの量は、Snと金属との間で金属間化合物(15)を形成するSnの化学量論量よりも多い。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN108430690US20180297152