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1. (WO2017134972) IMAGING ELEMENT PACKAGE AND IMAGING DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/134972 International Application No.: PCT/JP2017/000051
Publication Date: 10.08.2017 International Filing Date: 04.01.2017
IPC:
H01L 27/14 (2006.01) ,H01L 23/02 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants:
ソニー株式会社 SONY CORPORATION [JP/JP]; 東京都港区港南1丁目7番1号 1-7-1 Konan, Minato-ku, Tokyo 1080075, JP
Inventors:
渡部 剛 WATANABE, Tsuyoshi; JP
大瀧 豊 OOTAKI, Yutaka; JP
Agent:
大森 純一 OMORI, Junichi; JP
Priority Data:
2016-01717801.02.2016JP
Title (EN) IMAGING ELEMENT PACKAGE AND IMAGING DEVICE
(FR) BOÎTIER D'ÉLÉMENT D'IMAGERIE ET DISPOSITIF D'IMAGERIE
(JA) 撮像素子パッケージ及び撮像装置
Abstract:
(EN) An imaging element package according to one mode of the present invention is provided with a solid-state imaging element, a translucent substrate, and a package substrate. The solid-state imaging element has a light receiving surface including a light receiver and a first terminal, and a re arsurface on the opposite side from the light receiving surface. The translucent substrate is arranged facing the light receiving surface. The package substrate has a frame, a second terminal, and a support. The frame has a joining surface joined to the translucent substrate, and an accommodating part for accommodating the solid-state imaging element. The second terminal is provided on the frame, and is wire-bonded to the first terminal. The support is provided on the peripheral edge of the light receiving surface or in the center part of the ea rear surface, and partially supports the light receiving surface or the rear surface.
(FR) Un boîtier d'élément d'imagerie selon un mode de la présente invention comprend un élément d'imagerie à semi-conducteurs, un substrat translucide et un substrat de boîtier. L'élément d'imagerie à semi-conducteurs comporte une surface de réception de lumière comprenant un récepteur de lumière et une première borne, et une surface arrière sur le côté opposé à la surface de réception de lumière. Le substrat translucide est disposé en face de la surface de réception de lumière. Le substrat de boîtier comprend un cadre, une seconde borne et un support. Le cadre comprend une surface de jonction assemblée au substrat translucide, et une partie logement pour loger l'élément d'imagerie à semi-conducteurs. La seconde borne est montée sur le cadre et est microcâblée à la première borne. Le support est disposé sur le bord périphérique de la surface de réception de lumière ou dans la partie centrale de la surface arrière, et soutient partiellement la surface de réception de lumière ou la surface arrière.
(JA) 本技術の一形態に係る撮像素子パッケージは、固体撮像素子と、透光性基板と、パッケージ基板とを具備する。上記固体撮像素子は、受光部と第1の端子部とを含む受光面と、上記受光面とは反対側の裏面とを有する。上記透光性基板は、上記受光面に対向して配置される。上記パッケージ基板は、フレーム部と、第2の端子部と、支持体とを有する。上記フレーム部は、上記透光性基板に接合される接合面と上記固体撮像素子を収容する収容部とを有する。上記第2の端子部は、上記フレーム部に設けられ、上記第1の端子部とワイヤボンド接続される。上記支持体は、上記受光面の周縁部又は上記裏面の中心部に設けられ、上記受光面又は上記裏面を部分的に支持する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
US20190035836