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1. WO2017134701 - POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION

Publication Number WO/2017/134701
Publication Date 10.08.2017
International Application No. PCT/JP2016/000618
International Filing Date 05.02.2016
IPC
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
022
Quinonediazides
023
Macromolecular quinonediazides; Macromolecular additives, e.g. binders
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G03F 7/023 (2006.01)
G03F 7/004 (2006.01)
CPC
G03F 7/004
G03F 7/023
G03F 7/039
G03F 7/162
G03F 7/168
G03F 7/20
Applicants
  • 日立化成デュポンマイクロシステムズ株式会社 HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. [JP/JP]; 東京都文京区後楽一丁目4番25号 4-25, Koraku 1-chome, Bunkyo-ku, Tokyo 1120004, JP
Inventors
  • 松川 大作 MATSUKAWA, Daisaku; JP
  • 中村 惟允 NAKAMURA, Tadamitsu; JP
Agents
  • 渡邊 喜平 WATANABE, Kihei; JP
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE DE TYPE POSITIF
(JA) ポジ型感光性樹脂組成物
Abstract
(EN)
Provided is a positive-type photosensitive resin composition containing (a) a polybenzoxazole precursor, (b) a crosslinking agent, (c) a photosensitizer, and (d) a solvent, wherein the (a) polybenzoxazole precursor includes a structure represented by formula (1) below, and the (c) photosensitizer includes a structure represented by formula (2) below. In formula (1), U represents a divalent organic group, a single bond, -O-, or -SO2-, and V represents a group which contains an aliphatic structure having 1-30 carbon atoms.
(FR)
L'invention concerne une composition de résine photosensible de type positif contenant (a) un précurseur de polybenzoxazole, (b) un agent de réticulation, (c) un photosensibilisant, et (d) un solvant, le (a) précurseur de polybenzoxazole comprenant une structure représentée par la formule (1) ci-dessous, et le (c) photosensibilisant comprenant une structure représentée par la formule (2) ci-dessous. Dans la formule (1), U représente un groupe organique divalent, une liaison simple, -O-, ou -SO2-, et V représente un groupe qui contient une structure aliphatique ayant 1 à 30 atomes de carbone.
(JA)
(a)ポリベンゾオキサゾール前駆体と、(b)架橋剤と、(c)感光剤と、(d)溶剤とを含有し、前記(a)ポリベンゾオキサゾール前駆体が下記式(1)で表される構造を含み、前記(c)感光剤が下記式(2)で表される構造を含む化合物であるポジ型感光性樹脂組成物。式(1)中、Uは2価の有機基、単結合、-O-又は-SO-であり、Vは脂肪族構造を含む基であり、前記脂肪族構造の炭素数は1~30である。
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