Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2017134701) POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/134701 International Application No.: PCT/JP2016/000618
Publication Date: 10.08.2017 International Filing Date: 05.02.2016
IPC:
G03F 7/023 (2006.01) ,G03F 7/004 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
022
Quinonediazides
023
Macromolecular quinonediazides; Macromolecular additives, e.g. binders
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
Applicants:
日立化成デュポンマイクロシステムズ株式会社 HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. [JP/JP]; 東京都文京区後楽一丁目4番25号 4-25, Koraku 1-chome, Bunkyo-ku, Tokyo 1120004, JP
Inventors:
松川 大作 MATSUKAWA, Daisaku; JP
中村 惟允 NAKAMURA, Tadamitsu; JP
Agent:
渡邊 喜平 WATANABE, Kihei; JP
Priority Data:
Title (EN) POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE DE TYPE POSITIF
(JA) ポジ型感光性樹脂組成物
Abstract:
(EN) Provided is a positive-type photosensitive resin composition containing (a) a polybenzoxazole precursor, (b) a crosslinking agent, (c) a photosensitizer, and (d) a solvent, wherein the (a) polybenzoxazole precursor includes a structure represented by formula (1) below, and the (c) photosensitizer includes a structure represented by formula (2) below. In formula (1), U represents a divalent organic group, a single bond, -O-, or -SO2-, and V represents a group which contains an aliphatic structure having 1-30 carbon atoms.
(FR) L'invention concerne une composition de résine photosensible de type positif contenant (a) un précurseur de polybenzoxazole, (b) un agent de réticulation, (c) un photosensibilisant, et (d) un solvant, le (a) précurseur de polybenzoxazole comprenant une structure représentée par la formule (1) ci-dessous, et le (c) photosensibilisant comprenant une structure représentée par la formule (2) ci-dessous. Dans la formule (1), U représente un groupe organique divalent, une liaison simple, -O-, ou -SO2-, et V représente un groupe qui contient une structure aliphatique ayant 1 à 30 atomes de carbone.
(JA) (a)ポリベンゾオキサゾール前駆体と、(b)架橋剤と、(c)感光剤と、(d)溶剤とを含有し、前記(a)ポリベンゾオキサゾール前駆体が下記式(1)で表される構造を含み、前記(c)感光剤が下記式(2)で表される構造を含む化合物であるポジ型感光性樹脂組成物。式(1)中、Uは2価の有機基、単結合、-O-又は-SO-であり、Vは脂肪族構造を含む基であり、前記脂肪族構造の炭素数は1~30である。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
SG11201806631WCN108604059KR1020180101441EP3413132US20190049842PH1/2018/501573