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1. (WO2017134700) POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/134700 International Application No.: PCT/JP2016/000617
Publication Date: 10.08.2017 International Filing Date: 05.02.2016
IPC:
G03F 7/023 (2006.01) ,G03F 7/004 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
022
Quinonediazides
023
Macromolecular quinonediazides; Macromolecular additives, e.g. binders
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
Applicants:
日立化成デュポンマイクロシステムズ株式会社 HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. [JP/JP]; 東京都文京区後楽一丁目4番25号 4-25, Koraku 1-chome, Bunkyo-ku, Tokyo 1120004, JP
Inventors:
中村 惟允 NAKAMURA, Tadamitsu; JP
Agent:
渡邊 喜平 WATANABE, Kihei; JP
Priority Data:
Title (EN) POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE DE TYPE POSITIF
(JA) ポジ型感光性樹脂組成物
Abstract:
(EN) A positive-type photosensitive resin composition comprising (a) a polybenzoxazole precursor, (b) a crosslinking agent, (c) a photosensitizing agent, and (d) a solvent, wherein the (a) component includes a structural unit represented by formula (1), and the (b) component is a compound represented by formula (2). In formula (1), U is a bivalent organic group, a single bond, -O-, or -SO2-, V is a group including an aliphatic structure, and the carbon number of the aliphatic structure is 1-30. In formula (2), R1 are each independently a hydrogen atom or a group represented by -CH2-O-R2. At least one of the plurality of R1 is a group represented by -CH2-O-R2. R2 are each independently a hydrogen atom or a C1-6 alkyl group.
(FR) La présente invention a trait à une composition de résine photosensible de type positif, qui comprend (a) un précurseur de polybenzoxazole, (b) un agent de réticulation, (c) un agent photosensibilisant, et (d) un solvant, le constituant (a) incluant une unité structurale représentée par la formule (1), et le constituant (b) étant un composé représenté par la formule (2). Dans la formule (1), U représente un groupe organique bivalent, une liaison simple, -O-, ou -SO2-, V représente un groupe incluant une structure aliphatique, et le nombre d'atomes de carbone de la structure aliphatique est de 1 à 30. Dans la formule (2), chaque R1 représente individuellement un atome d'hydrogène ou un groupe représenté par -CH2-O-R2. Au moins un des R1 est un groupe représenté par -CH2-O-R2. Chaque R2 représente individuellement un atome d'hydrogène ou un groupe alkyle C1-6.
(JA) (a)ポリベンゾオキサゾール前駆体と、(b)架橋剤と、(c)感光剤と、(d)溶剤とを含有し、前記(a)成分が下記式(1)で表される構造単位を含み、前記(b)成分が下記式(2)で表される化合物であるポジ型感光性樹脂組成物。式(1)中、Uは2価の有機基、単結合、-O-又は-SO-であり、Vは脂肪族構造を含む基であり、前記脂肪族構造の炭素数は1~30である。式(2)中、Rは、各々独立に、水素原子又は-CH-O-Rで表される基である。複数のRの少なくとも1つは-CH-O-Rで表される基である。Rは、各々独立に、水素原子又は炭素数1~6のアルキル基である。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
SG11201806171XCN108604060KR1020180101440EP3413131US20190041748PH1/2018/501572