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1. (WO2017134545) HYBRID MASK FOR DEEP ETCHING
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CLAIMS

What is claimed is:

A method, comprising:

depositing a first mask material on a substrate;

depositing a second mask material on the first mask material;

depositing a third mask material on the second mask material;

patterning the third mask material with a pattern corresponding to one or more trenches for transfer to the substrate;

transferring the pattern from the third mask material to the second mask material;

transferring the pattern from the second mask material to the first mask material; and

transferring the pattern from the first mask material to the substrate.

The method of claim 1, further comprising removing the first mask material, the second mask material, and the third mask material by releasing the second mask material and the third mask material by dissolving the first mask material.

The method of claim 1, wherein the first mask material comprises a non-metallic material, the second mask material comprises a metallic material, and the third mask material comprises a non-metallic material.

The method of claim 3, wherein the first mask material comprises a negative tone photoresist and the third mask material comprises a positive tone photoresist.

The method of claim 1, wherein the step of transferring the pattern from the first mask material to the substrate comprises forming one or more through silicon vias (TSVs).

The method of claim 1, wherein the step of transferring the pattern from the first mask material to the substrate comprises etching an entire thickness of the substrate.

The method of claim 1, wherein the step of transferring the pattern from the first mask material to the substrate comprises etching one or more trenches around electronic components.

The method of claim 7, further comprising forming bonding pads in the one or more trenches around electronic components.

The method of claim 8, further comprising coupling the bonding pads to the electronic components; and encapsulating the electronic components.

The method of claim 9, wherein the steps of forming the bonding pads, coupling the bonding pads, and encapsulating the electronic components comprises forming a flexible electronics package.