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1. (WO2017134331) METHOD FOR THE MANUFACTURE OF AN EXTREMELY THIN FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD AND A FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/134331 International Application No.: PCT/FI2016/050062
Publication Date: 10.08.2017 International Filing Date: 01.02.2016
IPC:
H05K 1/11 (2006.01) ,H05K 3/46 (2006.01) ,H05K 3/42 (2006.01) ,B82Y 30/00 (2011.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
42
Plated through-holes
B PERFORMING OPERATIONS; TRANSPORTING
82
NANO-TECHNOLOGY
Y
SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; MEASUREMENT OR ANALYSIS OF NANO-STRUCTURES; MANUFACTURE  OR TREATMENT OF NANO-STRUCTURES
30
Nano-technology for materials or surface science, e.g. nano-composites
Applicants:
ELCOFLEX OY [FI/FI]; Vihikari 10 90440 Kempele, FI
Inventors:
TARVAINEN, Timo; FI
Agent:
BERGGREN OY; Isokatu 32 90100 Oulu, FI
Priority Data:
Title (EN) METHOD FOR THE MANUFACTURE OF AN EXTREMELY THIN FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD AND A FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD
(FR) PROCÉDÉ DE FABRICATION D'UNE CARTE DE CIRCUIT IMPRIMÉ MULTICOUCHE SOUPLE EXTRÊMEMENT MINCE, ET CARTE DE CIRCUIT IMPRIMÉ MULTICOUCHE SOUPLE
Abstract:
(EN) In the manufacturing method of a multilayer printed circuit board and in a multilayer printed circuit board of the invention, at least part from insulating, conductive or semi-conductive layers remaining inside the multilayer printed circuit board there are manufactured a printed circuit board by using a roll-to-roll manufacturing method for two or several semi-finished printed circuit boards. Between the conductive printed layers of a semi-finished printed circuit board it is possible to manufacture electric vias connecting these by printing. A flexible multilayer printed circuit board is manufactured by connecting at least two semi-finished printed circuit boards face to face so that the pure surfaces of the metal foils of the semi-finished printed circuit boards remain outermost. After this holes can be manufactured through the flexible multilayer printed circuit board, which are metal-plated to produce an electric via.
(FR) L'invention porte sur un procédé de fabrication d'une carte de circuit imprimé multicouche et sur une carte de circuit imprimé multicouche dans lesquels, au moins en partie à partir de couches isolantes, conductrices ou semi-conductrices restant à l'intérieur de la carte de circuit imprimé multicouche, une carte de circuit imprimé est fabriquée à l'aide d'un procédé de fabrication rouleau à rouleau pour au moins deux cartes de circuit imprimé semi-finies. Entre les couches imprimées conductrices d'une carte de circuit imprimé semi-finie, il est possible de fabriquer, par impression, des trous d'interconnexion électrique les connectant. Une carte de circuit imprimé multicouche souple est fabriquée par assemblage d'au moins deux cartes de circuit imprimé semi-finies face à face de manière que les surfaces pures des feuilles métalliques des cartes de circuit imprimé semi-finies restent à l'extérieur. Après cela, des trous peuvent être ménagés à travers la carte de circuit imprimé multicouche souple, lesquels sont revêtus de métal pour produire un trou d'interconnexion électrique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: Finnish (FI)
Also published as:
EP3412121