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1. WO2017133941 - MOLDED MODULE, METHOD FOR PRODUCING A MOLDED MODULE, AND MOLDING TOOL FOR THE OVERMOLDING OF A MOLDED MODULE

Publication Number WO/2017/133941
Publication Date 10.08.2017
International Application No. PCT/EP2017/051506
International Filing Date 25.01.2017
IPC
H01L 23/31 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H01L 21/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
CPC
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
H01L 21/565
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
565Moulds
H01L 2224/45014
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
4501Shape
45012Cross-sectional shape
45014Ribbon connectors, e.g. rectangular cross-section
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 2224/48472
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
484Connecting portions
4847the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
48472the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
H01L 23/3107
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
3107the device being completely enclosed
Applicants
  • ROBERT BOSCH GMBH [DE]/[DE]
Inventors
  • MICHELS, Daniel
  • AYDOGMUS, Irfan
  • SUENNER, Thomas
  • KLUTHE, Christian
  • MESSNER, Oliver
  • LEMM, Alexander
  • WEHRMANN, Frank
  • KOVACS, Vince
Priority Data
10 2016 201 800.005.02.2016DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) MOLDMODUL, VERFAHREN ZUR HERSTELLUNG EINES MOLDMODULS UND MOLDWERKZEUG FÜR DIE MOLDUMSPRITZUNG EINES MOLDMODULS
(EN) MOLDED MODULE, METHOD FOR PRODUCING A MOLDED MODULE, AND MOLDING TOOL FOR THE OVERMOLDING OF A MOLDED MODULE
(FR) MODULE MOULÉ, PROCÉDÉ DE FABRICATION D’UN MODULE MOULÉ ET MOULE POUR LE SURMOULAGE D’UN MODULE MOULÉ
Abstract
(DE)
Die Erfindung betrifft eine Moldmodul (1) mit mindestens einem elektronischen und/oder elektrischen Bauteil (3), welches von einer Moldmasse (30) umgeben ist, und mindestens einem am Modulrand angeordneten Einpresskontakt (20), welcher einen Kontaktierungsbereich (22) mit einer von beiden Oberflächen zugänglichen Einpressöffnung (24) aufweist, sowie ein Verfahren zur Herstellung eines solchen Moldmoduls (1) und ein Moldwerkzeug für die Moldumspritzung eines solchen Moldmoduls (1). Hierbei ist die Moldmasse (30) im Bereich des mindestens einen Einpresskontaktes (20) abgesetzt und bildet auf beiden Ober- flächen des Einpresskontaktes (20) jeweils einen Moldkragen (32) aus, welcher den korrespondierenden Einpresskontakt (20) bereichsweise umschließt und bei der Kontaktierung auftretende Einpresskräfte aufnimmt und oberhalb und unterhalb der korrespondierende Einpressöffnung (24) jeweils einen Raum (34) freilässt, wobei der Einpresskontakt (20) auf beiden Oberflächen um die Einpressöffnung (24) eine Verprägungszone (26) aufweist, welche den Kontaktierungsbereich (22) von der Moldmasse (30) trennt.
(EN)
The invention relates to a molded module (1), having at least one electronic and/or electrical component (3), which is enclosed by a molding mass (30), and having at least one press-in contact (20), which is arranged on the module edge and which has a contacting region (22) having a press-in opening (24) accessible from both surfaces, and to a method for producing such a molded module (1), and to a molding tool for the overmolding of such a molded module (1). The molding mass (30) is deposited in the region of the at least one press-in contact (20) and forms a molded collar (32) on both surfaces of the press-in contact (20), which molded collar extends around the corresponding press-in contact (20) in some areas and absorbs press-in forces occurring in the event of contacting and leaves a space (34) open above and below the corresponding press-in opening (24), wherein the press-in contact (20) has a stamping zone (26) on both surfaces around the press-in opening (24), which stamping zone separates the contacting region (22) from the molding mass (30).
(FR)
L’invention concerne un module moulé (1) comportant moins un composant (3) électronique et/ou électrique qui est entouré d’une matière de moulage (30) ainsi qu’un contact à enfoncement (20) disposé au niveau du bord du module, ledit contact à enfoncement présente une zone de mise en contact (22) comportant une ouverture d’enfoncement (24), accessible depuis les deux surfaces. L’invention concerne également un procédé de fabrication d’un module moulé (1) de ce type ainsi qu'un moule pour le surmoulage d'un module moulé (1) de ce type. Selon l'invention, la matière de moulage est abaissée dans la zone dudit au moins un contact à enfoncement (20) et constitue sur les deux surfaces du contact à enfoncement (20), respectivement un collet de moule (32) qui entoure par endroits le contact à enfoncement (20) correspondant et absorbe les forces de pression d'enfoncement exercées lors de la mise en contact et laisse un espace (34) dégagé, respectivement au-dessus et au-dessous de l'ouverture d'enfoncement (24) correspondante, le contact à enfoncement (20) présentant une zone repoussée par estampage (26) qui sépare la zone de mise en contact (22) de la matière de moulage (30).
Also published as
Latest bibliographic data on file with the International Bureau